method for protecting a surface, system for use in surface protection and method for laser machining

专利摘要:

公开号:BR112014013742B1
申请号:R112014013742-0
申请日:2012-12-07
公开日:2018-12-11
发明作者:Andrew C. Forsman；Billy L. Johnson；Charles P. Moeller；Erik H. Lundgren；James A. Carmichael；Timothy C. Bertch
申请人:General Atomics；
IPC主号:

专利说明:

(54) Title: METHOD FOR PROTECTING A SURFACE, SYSTEM FOR USE IN PROTECTING SURFACES AND METHOD FOR LASER MACHINING (73) Holder: GENERAL ATOMICS. Address: 3350 General Atomics Court, San Diego, CA 95121-1195, UNITED STATES OF AMERICA (US) (72) Inventor: ANDREWC. FORSMAN; BILLY L. JOHNSON; CHARLES P. MOELLER; ERIK H. LUNDGREN; JAMES A. CARMICHAEL; TIMOTHY C. BERTCH.
Validity Term: 20 (twenty) years from 12/07/2012, subject to legal conditions
Issued on: 12/11/2018
Digitally signed by:
Liane Elizabeth Caldeira Lage
Director of Patents, Computer Programs and Topographies of Integrated Circuits
1/78 "METHOD FOR PROTECTING A SURFACE, SYSTEM FOR USE IN PROTECTING SURFACES AND METHOD FOR LASER MACHINING" Field of the Invention [001] The present invention generally relates to laser machining, and more specifically the protection from unwanted incidence laser in one piece.
Background of the Invention [002] In laser machining, a series of laser pulses is impacted against a target part in order to drill a hole through the part. However, laser energy typically either passes through the part or is reflected in the part, and then propagates to an area or other surface of the part and causes damage to the part. For example, laser energy results in damage to a rear wall or across the surface of the part opposite the part of the part where the hole is formed. Typical approaches to mitigate this damage to the rear wall include the introduction of a fluid medium between the surface to be drilled and the surface of the back wall of the part, where the fluid includes barrier or absorption properties such as light absorbing particles, particles pigment, dye, fluorescent particles or a water / oil emulsion with light scattering properties.
Description of the Invention [003] Several embodiments of the invention advantageously address the above needs as well as other needs by providing methods for protecting a surface during laser machining. In some embodiments, methods for protecting a surface during laser machining include: directing a fluid into a cavity of an object being laser machined, where the fluid has no laser absorbing properties; and direct a plurality of laser pulses to a wall of the object being laser machined, where the laser pulses are
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2/78 configured to form a hole through the wall so that at least one laser pulse passes through the hole and enters the cavity as the fluid is directed into the cavity so that the laser pulse is incident on the fluid and in a surface together in order to inhibit damage to the rear wall.
[004] Some realizations provide systems for use in protecting surfaces during laser machining, which comprise: a protective substrate configured to be positioned inside a cavity of an object to be laser machined so that the laser pulse it performs the laser machining is incident on the protective substrate when the laser pulse passes through a hole in the object formed by laser machining and enters the cavity, where the laser pulse is inhibited from striking a back surface of the object through the orifice cavity; a fluid source positioned relative to the protective substrate, where the fluid source is configured to direct a fluid towards the protective substrate.
[005] In other embodiments, the methods for laser machining include: configuring a laser source relative to an object to be laser machined, where the object to be machined has an internal cavity in a part of the object to be laser machined ; control the laser source to produce a series of laser pulses; supplying a fluid into the cavity at the same time when performing the laser source control; and control which of the laser pulses are directed at a part of the object where an orifice must be produced so that less than all laser pulses are directed at the object where a synchronism between pulses that are directed at the object provides protection for a wall object against damage that would otherwise be caused by one or more of the laser pulses directed at the object.
Brief Description of the Drawings [006] The aspects, characteristics and advantages above and others
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3/78 of the various embodiments of the present invention will be more evident from a more particular description of it below, presented in conjunction with the drawings below.
[007] FIGURE 1 depicts a simplified sectional view of an object to be laser machined.
[008] FIGURE 2 depicts a simplified sectional view of the object of FIGURE 1 during laser machining when a laser pulse penetrates the wall and causes damage to a surface of the rear wall.
[009] FIGURE 3 depicts a simplified diagram of a protection system according to some realizations.
[010] FIGURE 4 depicts a simplified diagram of a protective substrate that cooperates with a fluid conduit, according to some realizations.
[011] FIGURE 5 depicts a simplified perspective view of a protective substrate according to some embodiments.
[012] FIGURE 6 depicts a simplified partial cross-sectional view of a protective substrate according to some embodiments.
[013] FIGURE 7 depicts a simplified perspective view of a protection system according to some realizations.
[014] FIGURE 8 depicts a simplified block diagram of a laser machining system according to some realizations.
[015] FIGURE 9 depicts a simplified block diagram representation of a laser machining system according to some realizations.
[016] FIGURE 10A depicts a simplified block diagram showing an exemplary implementation of the laser system and pulse stroke deviation of FIGURE 9 according to some realizations.
[017] FIGURE 10B depicts a timing diagram
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4/78 simplified representative of laser pulse timing used in laser machining according to some achievements.
[018] FIGURE IOC depicts a simplified block diagram showing an exemplary implementation of the laser system and pulse stroke deviation of FIGURE 9 according to some achievements.
[019] FIGURE 10D depicts a simplified timing diagram representative of laser pulse timing used in performing laser machining according to some achievements.
[020] FIGURE 11 depicts a simplified flow chart of a laser machining process while providing protection to the rear wall, according to some achievements.
[021] FIGURE 12 depicts a simplified flow chart of a laser machining process while protecting a surface of the back wall of an object being laser machined, according to some achievements.
[022] FIGURE 13 depicts a simplified flow chart of an object's laser machining process according to some achievements.
[023] FIGURE 14 depicts a simplified flow chart of a process, according to some realizations, to protect an object's back wall during laser machining of that object.
[024] FIGURE 15 depicts a simplified diagram section view of an object during laser machining according to some realizations.
[025] FIGURE 16A depicts a simplified timing diagram representative of laser pulse timing used in performing laser machining according to some embodiments.
[026] FIGURE 16B depicts a timing diagram
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5/78 simplified representative of laser pulse timing used in laser machining according to some achievements.
[027] FIGURE 17 shows a simplified timing diagram representative of the laser pulse timing used in performing laser machining according to some achievements.
[028] FIGURE 18 depicts a simplified block diagram of a laser machining system, according to some realizations.
[029] FIGURE 19 depicts a simplified flow chart of a process to provide protection of the rear wall during laser machining, according to some achievements.
[030] FIGURE 20 depicts a simplified flow chart of an object's laser machining process according to some achievements.
[031] FIGURE 21 shows an exemplary sectional view of an object that has been laser drilled without protection of the rear wall.
[032] FIGURE 22, however, shows an exemplary sectional view of an object that has been laser drilled while applying protection to the rear wall according to some achievements.
[033] FIGURE 23 depicts a cut view of a simplified diagram of a laser machining protection system according to some realizations.
[034] FIGURE 24 depicts a simplified section view of an alternative laser machining protection system according to some realizations.
[035] FIGURE 25 illustrates a system for use in implementing methods, techniques, control, devices, devices, systems, computers and the like to provide laser machining to the same
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6/78 time that protects a back wall surface of an object being laser machined according to some achievements.
[036] FIGURES 26 and 27 show images of protection systems with protective substrates, according to some realizations.
[037] FIGURE 28 shows a perspective view of a protection system for use in a laser machining protection system according to some realizations.
[038] FIGURE 29 shows a simplified sectional view of a part of the protection system of FIGURE 28, according to some embodiments.
[039] FIGURE 30 shows a perspective view of the protection system of FIGURE 28 relative to a mounting post that is used to position the protective substrate of the protection system within an object to be laser machined, according to some achievements.
[040] FIGURE 31 illustrates a simplified partial cross-sectional view of a part of the protection system of FIGURE 28 positioned within an exemplary object being laser machined, according to some realizations.
[041] FIGURE 32 shows a simplified sectional view of the protection system of FIGURE 31 on the A-A axis, according to some realizations.
[042] FIGURE 33A shows a simplified section view of a part of a laser protection system, according to some embodiments.
[043] FIGURE 33B illustrates a simplified partial cross-sectional view of a part of the laser protection system of FIGURE 33A positioned within an exemplary object being laser machined, according to some embodiments.
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7/78 [044] FIGURE 34A shows a simplified section view of a part of a laser protection system, according to some embodiments.
[045] FIGURE 34B illustrates a simplified partial sectional view of a part of the laser protection system of FIGURE 34A positioned within an exemplary object being laser machined, according to some embodiments.
[046] FIGURE 35 shows an image of an object with laser damage as a result of laser machining carried out without protection of the rear wall.
[047] FIGURE 36 shows an image of an object without damage to the rear wall after laser machining has been carried out while protecting the rear wall according to some achievements.
[048] Corresponding reference characters indicate corresponding components across all the different views of the drawings. Experts will assess that the elements in the figures are illustrated for simplicity and clarity and were not necessarily drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help improve the understanding of various embodiments of the present invention. Also, well-known but common elements that are useful or necessary in a commercially viable embodiment are often not portrayed in order to facilitate a less obstructed view of these various embodiments of the present invention.
Description of Realizations of the Invention [049] The following description should not be taken in a sense of limitation, but is made purely for the purpose of describing the general principles of exemplary realizations. The scope of the invention should
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8/78 be determined with reference to the claims.
[050] Reference throughout this specification for an embodiment, some embodiments, some implementations or similar expression means that a particular feature, structure, or feature described in connection with the embodiment is included in at least one embodiment of the present invention. Therefore, appearances of expressions in one embodiment, in some embodiments, and similar expression throughout this specification may, but not necessarily, all refer to the same embodiment.
[051] In addition, the features, structures, or features described of the invention can be combined in any suitable manner in one or more embodiments. In the following description, several specific details are provided, such as programming examples, software modules, user selections, network transactions, database queries, database structures, hardware modules, hardware circuits, hardware microcircuits, etc., to provide a complete understanding of the achievements of the invention. A person skilled in the art will recognize, however, that the invention can be practiced without one or more of the specific details, or with other methods, components, materials, and so on. In other cases, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the invention.
[052] FIGURE 1 depicts a simplified diagram section view of an object 112 to be machined or laser machined. For example, laser machining can be aimed at laser drilling a hole through a wall 114 of object 112 in a predefined position 116. In some cases, however, laser machining can cause damage to an opposite surface 120 to the wall being machined when the pulses of
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9/78 lasers that perform machining penetrate the wall 114 and enter a cavity 122 of the object and impact the surface 120. For simplicity, the surface 120 opposite the wall being machined is referred to below as a back wall surface.
[053] FIGURE 2 depicts a simplified diagram section view of object 112 during laser machining when a laser pulse 212 penetrates wall 114. During laser machining the laser pulses form a hole 214 in wall 114. Typically, one or more additional laser pulses are directed at the object to achieve a desired orifice size and / or quality. Consequently, at least a part of those laser pulses directed at the object is established after an initial orifice to penetrate through the orifice 214, enter the cavity 122 and be able to collide on the surface of the rear wall 120. Consequently, the laser pulse 212 colliding on the back wall surface 120 can cause damage 220 to the back wall surface, particularly when the back wall surface 120 is relatively close to hole 214. The amount of damage that can result can depend on many factors including, but not limited to distance between a focus 218 of the laser pulse 212 and the back wall surface 120, the intensity and / or power of the laser pulse, the rate or angle of dispersion of the laser pulse, the duration of exposure of the laser pulse on the surface of the back wall 120, polarization, pulse energy and other factors such as the depth of the hole being drilled, the material, the size, and the bottleneck.
[054] It is noted that the purpose of laser machining is typically intended to generate hole 214 or another gap within wall 114 and consequently the laser pulse 212 that passes through hole 214 collides on the surface of the back wall 120 is likely to cause damage, particularly when the rear wall surface is relatively
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10/78 close to the laser spot 218. In some cases, damage 220 can be extensive enough to cause exterior damage 222 to an outer surface 224 and / or produce an unwanted hole through the wall that defines the surface of the rear wall 120 Consequently, some embodiments provide systems, apparatus, methods and processes to limit and / or prevent damage to the back wall surface 120.
[055] FIGURE 3 depicts a simplified diagram of a protection system 310 according to some realizations. The protection system 310 includes a protective substrate 312 that extends from a support 314. The support is configured to be positioned within a cavity 318 of an object 320 being laser machined and to position the protective substrate 312 at a location within cavity 318 in the path of laser pulse 324.
[056] During laser machining, laser pulse 324 is directed at a wall 326 of object 320. For example, in some cases, a series of laser pulses is directed at wall 326 forming a hole 330 in the wall. When a series of laser pulses penetrate the wall, the laser pulses can continue through cavity 318 and collide with the protective substrate 312. Consequently, the protective substrate 312 limits and in some cases prevents the laser pulses from hitting a surface. rear wall 332 and prevents damage to the rear wall surface.
[057] In some embodiments, support 314 may comprise and / or be formed additionally from a conduit that couples to a fluid source (not shown in FIGURE 3). Consequently, fluid conduit 314 can deliver fluid into cavity 318, and is typically provided for the fluid to contact protective substrate 312. Additionally, in some embodiments, the conduit is configured to direct the fluid to impact a surface. protective substrate 312.
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11/78
Consequently, the fluid from the conduit is in contact with the surface on which the laser pulses collide. The fluid restricts the expansion of plasma formed on the surface to thereby help reduce the increase in local laser absorption that would accompany the longer gradients of material protection substrate that would otherwise exist and in at least some cases help maintain reflectivity the surface to reflect at least some of the laser pulses. The reflected laser pulses continue to spread, reducing the intensity and the likelihood of causing additional damage to the interior surfaces of the cavity. The fluid additionally helps to dissipate heat and limits degradation of the plasma production surface of the protective substrate 312. In addition, the fluid can limit material agitation as a result of laser machining and potential damage to coatings on interior surfaces of the object as a result agitation. In some cases, the fluid can be cooled and pressurized in the duct so that as a result of the release it tends to freeze.
[058] The object 320 can be oriented, in some implementations, to assist in the removal of the fluid introduced into the cavity 318 and / or to allow the excess fluid that impacts the protective substrate 312 to be removed from the protective substrate, which it can provide a flow of fluid over the protective substrate and increase a cooling effect provided by the fluid. For example, in some implementations, the object can be positioned so that gravity drains excess fluid from the cavity at a rate that is at least equal to or greater than the rate at which the fluid is delivered through the fluid conduit 314. Additionally or alternatively, a vacuum force can be applied to assist in removing the fluid. In many embodiments, it is important to maintain fluid contact with the protective substrate 312 and not to flood the hole 330 being drilled with fluid. Consequently, the fluid flow towards the
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12/78 of the protective substrate 312 being hit by the laser, and subsequently into cavity 318, is regulated. If the fluid flow rate is too low then the protective substrate 312 may not remain adequately coated, and if the flow rate is too high then it may be difficult or impossible to prevent the fluid from entering the vicinity of the orifice 330 being perforated. These two competing factors may be less stringent when the cavity is larger. Some laboratory tests for some cavity sizes and laser powers that perform drilling for certain hole sizes have shown that the flow rate is on the order of approximately 1 m / s or more, such as during laser machining with pulse rates approximately 2000 pulses per second.
[059] In some embodiments, the protection system 310 additionally includes a gas conduit 340, which is configured to also be positioned inside the cavity 318. Additionally, the gas flow conduit can be positioned relative to a part of the cavity where orifice 330 is being drilled. A gas, such as air, oxygen or other relevant gas can be directed into the cavity to limit, and in some cases, prevent the liquid supplied by the fluid conduit 314 from entering orifice 330 once formed by laser machining. For example, a gas duct outlet opening 340 can be positioned to direct a flow of gas through orifice 330 and can force the fluid away from the orifice. Additionally or alternatively, in some cases one or more gas flows or external jets can be directed relative to the orifice 330 being worked. The internal air jet and / or the external air jets also play a role in preventing fluid from entering orifice 330 and / or surrounding the orifice being drilled. In some embodiments, the external air jet is arranged to be generally coaxial to the drilling laser (for example, focusing the laser through an orifice or conduit in a gas distribution nozzle). An
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13/78 substantial pressure in the external air jet (for example, measured in tenths of PSI or the like, which may depend on the size of the hole being drilled, the pulse rate and / or other work being done), combined with a very modest supply rate for the internal air jet, it helps a lot to remove water from the vicinity of the hole being drilled. It may be additionally important to regulate the flow of air to the internal air jet so that the fluid is drawn from the orifice 330 being drilled, but not so much that it blows the fluid out of contact with the protective substrate 312.
[060] FIGURE 4 depicts a simplified diagram of the protective substrate 312 that cooperates with the fluid conduit 314. In some embodiments, the protective substrate 312 is positioned at an angle 412 relative to the fluid conduit 314. When the fluid leaves of the fluid conduit it may have sufficient strength to directly impact a first surface 414 of the protective substrate 312. Similarly, the protective substrate 312 can be configured so that when the protective system 310 is positioned inside the cavity 318, the protective substrate 312 is at an oblique angle 416 relative to the path, direction of travel or geometric axis 420 of the laser pulse 324. As such, the laser pulse can be dispersed over a larger area of the protective substrate 312. Although this may be the case in some achievements, this is not always necessary. For example, in some cases the protective substrate 312 can be positioned perpendicular to the laser pulse 324. The configuration, orientation, angle and the like of the protective substrate 312 relative to the geometric axis of the laser 420, in some implementations, can be selected to cooperate and / or better protect the device being protected. For example, the inner side of most fuel injectors is cone-shaped, and consequently, the protective substrate can be positioned in a
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14/78 angle so that the laser beam fits more easily into the cavity. In other embodiments, the protective substrate may have an alternative configuration, such as a cone or conical, parabolic shape, or other shape that has a desired angle relative to the geometric axis 420 of the laser pulse 324. In other cases, the substrate of protection can take alternative shapes such as circular, spherical, tubular or other relevant shapes. Additionally or alternatively, in some embodiments the protective substrate can be moved or rotated to distribute the exposure of the laser pulses over a larger area and / or increase the cooling of the protective substrate. For example, in some cases, the protective substrate may be radially symmetrical (for example, a molded tube with holes formed on the surface). Additionally, the protective substrate can, in some embodiments, be rotated to change the surface area of the protective substrate on which the laser collides.
[061] The protective substrate 312 can be configured from one or more of several materials. In some embodiments, the protective substrate 312 is an extension of the fluid conduit 314. For example, the fluid conduit 314 can be cut close to the edge to form the protective substrate 312. In addition, the cut protective substrate 312 can be cut molded and / or bent to a desired angle 412. In still other embodiments, the protective substrate 312 is cut or formed at a desired angle and fixed or otherwise attached to the fluid conduit 314. The dimensions of the protective substrate 312 can additionally depending on the size of the cavity 318, the expected height, width and / or diameter 424 of the laser pulse 324. Similarly, the size or diameter 430 of the protective conduit may depend on the size of the cavity, and the expected amount of fluid to be delivered, the size of the laser pulse, the size of the protective substrate 312 and / or other
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15/78 factors. Additionally, in some embodiments, the protective substrate 312 can be configured with structures, irregularities, incongruities and / or surface variations, such as, but not limited to depressions, openings, protrusions, obstacles, spikes, pyramids, grooves, grooves, notches, projections, roughness and / or other structures, irregularities or combinations of surfaces of these structures and / or surface irregularities.
[062] In some tests, the protective substrate 312 was made from a thin sheet of material, cut to shape, then glued with tape or glued to the end of the conduit 314. In some cases it may be desirable to form a protective substrate that provides 360 degrees of coverage except where the hole being drilled enters the cavity. In which case, both air and water can enter properly positioned slits connected to the ducts through a rotating collar.
[063] FIGURE 5 depicts a simplified perspective view of a protective substrate 312 according to some embodiments. The protective substrate 312 can be configured with a plurality of openings 512, recesses, or other such surface structures. In some embodiments, the protective substrate 312 comprises a grid or matrix of openings 512 with the openings extending through the protective substrate. The protective substrate 312 can be constructed from various materials or combinations of materials. For example, in some embodiments, the protective substrate may be constructed of the same material and / or cut from the 314 fluid conduit. In addition or alternatively, the protective substrate 312 may be made of Inconel®, copper, nickel, steel , carbon, ceramic, silver, refractory metals, tungsten carbide, or other such materials or combinations of these materials. In addition, in some cases the material used is selected to be at least partially reflective, polished to be reflective and / or the surface on which the laser pulse strikes can be
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16/78 coated with a reflective material.
[064] As described above, the dimensions of the protective substrate 312 may depend on the laser machining expected to be performed, the quantity and / or the type of fluid supplied into cavity 118 of the object 320 being machined, the expected diameter or dimensions 424 and / or the cross-sectional area of the laser pulses, the type, intensity and / or power of the laser pulses applied in machining, the expected duration of exposure to the laser pulses, and other similar factors. For example, some successful test results to date have been achieved by following, at least in part, four design principles. First, the protective substrate is located so that it is as far from the laser focus as possible. For example, when working with a fuel injector laser, the protective substrate 312 can benefit from being positioned against the wall of the cavity opposite the hole being drilled (for example, in some tests 1 to 3 mm away from the hole that is being drilled). is being drilled). This design principle can determine that the protective substrate is properly shaped in order to be located in this way. In a case where there is sufficient distance available, then after a certain distance from the rear wall, placing the protective substrate further apart adds little value.
[065] Second, better results have been obtained for at least some implementations using a material (for example, Inconel) that is inherently very strong and needs to reach a high temperature before softening. Although the exact mechanism responsible for this benefit is not clear, it is possible that strong materials are more resistant to the erosion that arises from the cavitation inherent in the interaction between the protective substrate and the fluid under the action of the laser pulses.
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17/78 [066] Third, when the 512 grid of tapered holes in the protective substrate is formed, some materials are easier to form the desired orifice pattern than others. The desired orifice pattern for at least some implementations is one in which the orifices gradually taper, not quickly, and are typically compressed as close together as possible. For cases where the protective substrate does not have a 512 grid of holes established therein, this consideration is null.
[067] Fourth, the protective substrate is selected to be thick enough that there is a margin for ablation of the protective substrate itself. In some tests, the first hundred pm of top of the protective substrate is ablated while drilling the first several orifices in an injector, and subsequently exhibits a much slower ablation rate. The exact mechanism underlying this behavior is not known, but it can be related to fine adjustment of the incidence angles that the laser experiences when it arrives and finds the protective substrate. In some experiments, a thickness of 300 pm was selected.
[068] Other design principles may additionally or alternatively be taken into account. For example, some achievements are configured to direct the fluid into the protective substrate so that the fluid enters the substrate openings.
[069] Additionally, the fluid can be directed to the substrate at such an angle and with sufficient strength to ensure that the fluid enters most openings to one or more pre-defined fill levels.
[070] FIGURE 6 depicts a simplified partial section view of a protective substrate 312 according to some embodiments. The protective substrate 312 may include the plurality of openings 512 that extend through the thickness of the protective substrate from a
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18/78 first surface 612 to second surface 614. In some embodiments, the wall of openings 512 tapers between the first surface 612 and the second surface 614 and / or is generally tapered.
[071] The inclusion of the 512 openings and the tapered configuration both provide an increased surface area over which the laser pulse is incident. As such, the laser pulse is distributed over the increased surface area that diffuses the laser energy while providing increased heat dissipation. This diffusion of the laser energy is additional to that provided, in some embodiments, by positioning the protective substrate 312 at an angle 416 relative to the laser pulse. In addition, when the fluid delivered through the fluid conduit 314 contacts the protective substrate 312 the fluid can partially and / or completely fill some or all of the openings 512 providing increased amounts of fluid in the areas where the laser pulse collides, which can provide additional heat dissipation and can additionally assist in controlling the degradation of the plasma production surface of the protective substrate 312. The fluid typically restricts the expansion of the plasma formed on the surface to thereby help reduce the increase in local laser absorption that it would accompany the longer gradients of material protection substrate that might otherwise exist. This increase in laser absorption typically results in increased ablation of the protective substrate. In addition, the extension of the openings 512 through the protective substrate 312 provides an additional outlet for liquid and / or gases when the laser pulse collides on the fluids in contact with the protective substrate 312.
[072] The openings 512 can be positioned in several arrangements. In some cases, the openings are positioned in a hexagonal configuration and compressed very closely. In some implementations, the openings can be positioned in other
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19/78 configurations and / or the sizes or diameters of openings 512 can be varied. Additionally, in some cases, the openings 512 are laser drilled into the protective substrate 312 to obtain the desired density, positioning and / or shape or configuration of the opening. In some embodiments, the shape of the openings may vary, such as between openings, between regions of the protective substrate 312 or other similar configurations. In some instances, the protective substrate is configured with openings 512 having approximately a diameter 620 of 20 to 50 microns in the first surface 612 on which the laser is intended to collide. The openings taper to approximately 5 to 10 microns in diameter 622 on the second surface 614 over a depth 624 of approximately 200 to 400 microns. These openings are removed within a few pm from each other on the surface on which the laser is intended to collide. Some tests performed used a protective substrate with opening entries of approximately 18 to 27 pm and an exit of approximately 5 to 10 pm before use in drilling. Larger or smaller holes are possible. During use and when the top 100 pm or something similar to the protective substrate is ablated by the laser, the openings decrease to something like 10 to 15 pm and the spacing increases to approximately 10 pm or so, this spacing is difficult to define due to the surfaces being able to become more angled with respect to the original surface of the substrate.
[073] FIGURE 7 depicts a simplified perspective view of a 710 protection system according to some realizations. The protection system 710 includes the protective substrate 312 that cooperates with the fluid conduit 314, the gas conduit 340, a positioning support 712, a positioning arm 714, a fluid supply line 716 and a supply line of gas 718. The fluid conduit 314 and the gas conduit
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340 are cooperated with the positioning support 712 to maintain a position of the protective substrate 312, the fluid conduit 314 and the gas conduit 340.
[074] Additionally, the fluid supply line 716 and the gas supply line 718 are cooperated with the positioning support 712 to supply fluid and gas to the fluid conduit 314 and to the gas conduit 340, respectively. The positioning of the arm 714 is fixed with the positioning support 712, for example, screwed, screwed, welded, with pins, or the like, or combinations thereof. The positioning of the arm 714, in some embodiments, is additionally cooperated with one or more gears, motors or the like to position the positioning support 712 relative to the object 320 being laser machined and to position the protective substrate 312 inside a cavity 318 of the object 320 and / or in the path of the laser pulses. In other embodiments, object 320 is alternatively or additionally moved relative to protection system 310. In some embodiments, positioning support 712 is additionally configured to cooperate with object 320 being laser machined. For example, positioning bracket 712 may include one or more openings 722, flaps, alignment slots or the like that are configured to cooperate and / or assist in positioning an object 320 to be laser machined relative to protection system 310 and to the protective substrate 312. For example, when object 320 is a fuel injector, positioning bracket 712 can be configured to match the fuel injector so that the fuel injector or part of the fuel injector extends down into alignment opening 722 and / or extends around and corresponds to the outside of positioning bracket 712.
[075] Fluid duct 314 and gas duct 340 are
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21/78 dimensioned and cooperated with the positioning support 712 to allow the protective substrate 312, the fluid conduit 314 and the gas conduit 340 to be positioned at least partially within a cavity 318 of an object 320 being machined laser and in a desired location to allow the protective substrate 312 to be in the laser path as well as the gas conduit 340 to direct the gas flow along an internal surface of cavity 318 near the laser machined orifice 330. Consequently, in some cases, the dimensions of the protective substrates 312, fluid conduit 314 and / or gas conduit 340 are defined at least partially by the object 320 to be laser machined.
[076] FIGURE 8 depicts a simplified block diagram of an 810 laser machining system according to some realizations. The laser machining system 810 includes a laser system 812, a protection system 814 that cooperates with the object 816 to be laser machined, a motion control and / or positioning system 818 (referred to below as the positioning system ), and an 820 controller.
[077] Controller 820 can be configured as a single device or separate devices, such as one or more controllers, which can include one or more controllers in the laser system 812, protection system 814, positioning system 818 and / or a general controller. In some embodiments, the 820 controller comprises one or more processors and / or microprocessors coupled with memory that stores code, instructions and / or software to control the 810 laser machining system. In some implementations, the 820 controller can be at least partially implemented through a computer coupled to one or more of the laser system 812, the protection system 814 and the positioning system 818.
[078] The 812 laser system generates the laser pulses and directs
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22/78 the laser pulses to accurately impact the 816 object to be laser machined at the desired location on the 816 object. Typically, the 812 laser system includes lenses, slicers, collectors and the like to focus and direct the laser pulse to collide over the 816 object. In some embodiments, the 812 laser system includes additional elements and / or features, such as delay paths and the like to produce one or more laser pulses to collide over the 816 object to perform laser machining desired.
[079] The protection system 814 cooperates with the controller 820 and the object 816 to provide protection of the rear wall for the part of the object opposite the hole or other machining being generated. In some embodiments, the protective system 814 delivers a fluid into a cavity of the object 816 so that the fluid provides protection to the rear wall of the object 816 opposite the part of the object being laser machined. The protection system 814, in some embodiments, additionally includes a protective device for the rear wall (not shown in FIGURE 8) that is inserted into the cavity between the part of the object 816 being laser machined and the rear wall opposite to that part of the object being laser machined. For example, the rear wall protection device may comprise the protection system 710 of FIGURE 7. In other embodiments, the rear wall protection device may comprise a grid structure (e.g., column, tube, cubic structure, etc. .), a porous structure or other relevant structure that can be positioned between the hole being machined in object 816 and the rear wall. The protection system 814 may include additional or alternative components, such as, but not limited to, a gas source and distribution device, a fluid source coupled to the fluid conduit 314, one or more flow meters for the fluid (s) and / or gas (s), pressure regulators, and / or other similar components.
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23/78 [080] The positioning system 818 can cooperate with the laser system 812, the protection system 814 and / or the object 816 to position the components of the laser machining system 810 to precisely laser the object 816 while providing protection of the rear wall. The positioning system may include one or more motors, gears, pumps, pistons, hydraulics, cables, terminal manipulators, grips, and / or other similar devices for positioning components relative to each other. For example, in some implementations, the positioning system 818 is cooperated with the object 816 to control the positioning of and / or maintain the positioning of the object during laser machining and / or to reposition the object to perform additional laser machining ( for example, repositioning the object to laser multiple holes in the object 816). In other embodiments, the positioning system 818 can additionally or alternatively be cooperated with the protection system 814 to position at least a part of the protection system to accurately apply fluid within the cavity, to position a protective substrate 312 within the cavity and / or to position one or more gas sources relative to the surface being laser machined. Similarly, in some embodiments, the positioning system may provide in part some controls over the positioning of the 812 laser system or parts of the laser system to accurately focus and direct the laser pulse towards the 816 object.
[081] FIGURE 9 depicts a simplified block diagram representation of a 910 laser machining system according to some realizations. The 910 laser machining system includes a 912 laser system, one or more 914 pulse slicers and / or pulse collectors, a 916 beam delivery system, a 918 lens system, a 920 protection system, a controller 922, a 924 positioning system,
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24/78 gas supply 926 comprising a gas supplier 928, a pressure regulator 930 and in some cases one or more flow meters 832, and a fluid supply system 936 comprising a fluid supplier 938 and a or more flow meters 940. The laser machining system 910 may in some cases additionally include one or more 944 sensors and a 946 timing and signal processor.
[082] The 912 laser system includes one or more laser generators that generate relevant laser pulses to perform laser machining. The pulse slicer 914 is cooperated with the laser system 912 and directs desired amounts of pulses according to the desired pulse timing and / or pulse rate on object 950, which is typically a predefined period of time. The 916 beam delivery system directs one or more pulses towards the 950 object, and may include lenses such as, but not limited to, shutter, telescope, boring head, mirrors and the like. The 918 lens system typically includes one or more focusing lenses to accurately focus the laser pulses towards the 950 object. At least in some embodiments, two other details related to the equipment considered here may be included. First, a process control shutter can be used, in some embodiments, to regulate the total drilling time. Second, a pulse slicer can be used to reduce laser firing rates from approximately 10,000 shots per second to approximately 1000 to 2000 shots per second when desired. A different laser system may be able to achieve the desired trigger rates without any external pulse selection devices.
[083] The protection system 920 is positioned relative to the object 950 and / or the object is positioned relative to the protection system (for example, through the positioning system 924) so that the protection system
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920 can at least deliver the appropriate fluid into the cavity of the object 950 as delivered from the fluid supply system 936, and where relevant can deliver the gas as supplied by the gas supply system 926. In some cases, the system guard 920 and / or the gas supply system 926 provide a flow of gas (eg, air, oxygen, etc.) into the cavity close to the laser machining site. Additionally or alternatively, some embodiments provide a gas flow along an exterior of the 950 object at the laser machining site. In addition, in some cases the protection system 920 includes the protective substrate 312 which is positioned inside the cavity and in alignment with the laser pulses during laser machining. In many embodiments, the flow of gas along the outside is generally coaxial to the laser; consequently, it is more perpendicular to the surface of the object being worked than parallel.
[084] Controller 922 can be implemented through one or more computers and / or processors coupled to or as part of the various components of the 910 laser machining system. For example, controller 922 controls the gas supplier 928 and / or pressure regulator 930 based on feedback information provided by flow meter 932; controls fluid supplier 938 based on feedback information received from fluid meter flow 940. Similarly, in some embodiments, controller 922 can provide at least some controls over positioning system 924 that can control relative positioning of the object 950, protection system 920, laser system 912, pulse slicer 914 and / or other components or subcomponents of the laser machining system 910. For example, in some cases, the positioning system 924 can position an object 950 so that a first hole can be laser drilled through the object 950 when
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26/78 while the rear wall is protected, and following the laser perforation of the first hole the object 950 can be repositioned, such as rotated to align another part of the object 950 with the laser system so that a second hole can be laser perforated. Depending on the intended laser machining of the object 950, the laser system 912, object 950 and / or the protection system 920 can be positioned any number of times while multiple holes are laser drilled or other laser machining is performed on the object 950 .
[085] Additionally, in some implementations, controller 922 may provide at least in part control over the gas supply system 926 and / or the fluid supply system 936. For example, controller 922 may receive data from the flow meter. flow from one or more flow meters 932, 940 and use this information to control the pressure and / or flow of gas and / or fluid that is delivered to the 920 protection system. As introduced above, in some cases, the gas supply system 926 can direct a gas flow through an internal surface in the cavity of the object 950 while laser machining is being carried out, which can help to limit the entry of liquid into the orifice or other machined area generated in the object 950 during laser machining. Similarly, a gas flow can be directed through an exterior of the 950 object close to the area being laser machined, which can remove debris and splashes from the area being machined and also help to reduce or eliminate the amount of water or other fluids from entering the hole being drilled. This jet of external gas has in at least some tests been delivered coaxially to the laser beam. In addition, in some cases, the 918 lens system may include an auxiliary gas jet and consequently a 930 pressure regulator may be used to control the amount of gas supplied.
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27/78 [086] The one or more 944 sensors may be provided in some cases to detect and / or monitor various parameters. For example, in some implementations, a burn detector can be incorporated into the 920 protection system and / or positioned relative to the cavity separate from the 920 protection system. The burn detector can detect when a laser pulse penetrates the 950 object wall and enter the cavity. This detection can be used to control laser machining, such as adjusting the durations of the laser pulses, adjusting the durations between laser pulses, adjusting the durations between laser bursts, adjusting an intensity of laser pulses, adjusting the length of laser wave, forming the beam, trepanation, gas aid and / or other similar adjustments or combinations of these adjustments.
[087] For example, in some cases a burn detector is used in cooperation with controlling the laser pulses. Since the laser pulses generate a hole through the object's wall, it is typically preferred to continue drilling or laser machining to achieve the desired quality of the laser drilled hole. Consequently, at least some of each laser pulse directed at object 950 after an orifice is generated passes through the orifice and collides with the protective substrate 312 of the 920 protection system. In addition, some achievements reduce the pulse rate, which increases the duration between pulses or bursts of pulses. The increased duration between pulses or bursts can reduce adverse effects on the protective substrate and / or the back wall.
[088] Until the orifice is generated in object 950, however, it may be desirable to increase the pulse rate and consequently increase the machining rate. Therefore, a burn detector can be used to detect the initial generation of a hole in the 950 object. The sensor can notify a 946 signal processor or directly notify the 914 pulse slice.
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28/78 and / or controller 922 to control the pulse rate, such as reducing the rate of pulses that are directed at the 950 object. The reduced rate may depend on many factors, such as, but not limited to, the 950 object that is being machined, the material of the object being machined, the protective substrate 312 when used, the liquid flow rate, expected cavitation rate, laser intensity, cavity dimensions, and / or other similar factors or combinations of these factors. The burn detector or sensor 944 can be implemented, in some embodiments, through one or more photodiodes, which can be positioned inside the cavity or external to the cavity. Additionally, some embodiments additionally include an optical fiber that is optically cooperated with one or more photodiodes, where the end of the optical fiber away from the photodiode can be positioned within the cavity of the object 950, such as being cooperated with the 314 fluid conduit or conduit of gas 340.
[089] Additionally or alternatively, a 946 timer can be used to anticipate laser burn. Typically, the time required to perform the desired burn is known approximately. As such, the 946 timer can be used to anticipate burns so that the pulse rate can be adjusted to provide additional protection for the rear wall while still allowing for quick laser drilling.
[090] FIGURE 10A depicts a simplified block diagram showing an example of implementation of laser system 912 and pulse slicer 914 of FIGURE 9 according to some realizations. The laser system 912 may include a timing generator 1012 that cooperates with a laser 1014. Pulse slicer 914 may include a second timing generator 1018 and a pulse slicer 1020. Some embodiments include 1024 lenses for directing laser pulses along a desired route, the
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29/78 which can be directed to the 916 beam delivery system.
[091] FIGURE 10B depicts a simplified timing diagram representative of laser pulse timing used in performing laser machining according to some achievements. The laser pulses 1030 to 1032 are generated and directed to the object 950. The pulses 1030 to 1032 are separated by a duration 1036. For example, the duration 1036 can be approximately 0.5 ms. In addition, in some implementations, each laser pulse has a pulse duration within the range of approximately 10 ps to 100 ns. However, the protection of the rear wall provided by the present embodiments is not limited to these pulses and / or laser timing. Alternatively, the back wall protection can be used with substantially any laser pulses, laser pulse durations and / or durations between pulses or bursts of pulses. For example, some achievements provide rear wall protection for double pulse with 5 ps pulses, or single pulse machining with 100 f laser pulses. In some cases, the duration 1036 may vary over time based on a pre-defined machining schedule, such as as a result of detecting that the laser pulses have broken the wall of the object 950 being machined, a predicted amount of time or others similar factors.
[092] With reference to FIGURES 10A and B, the timing generator 1012 can in part arrange the pulses, with the second timing generator 1018 providing timing to coordinate the pulse slicer 1020 to accurately drive the pulses 1030 to 1032 accordingly with defined pulse rates to perform relative synchronism between pulses. 1024 lenses may include lenses relevant to aiming laser pulses, and may include, but are not limited to, one or more wave plates, polarizers and the like.
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30/78 [093] FIGURE 10C depicts a simplified block diagram showing an example of implementation of the laser system 912 and pulse slicer 914 of FIGURE 9 according to some realizations. The laser system 912 may include a first timing generator 1012 that cooperates with two lasers 1014 and 1015. Pulse slicer 914 may include a second timing generator 1018 and first and second pulse slicers 1020 and 1021. Some embodiments include lenses 1024 to combine or otherwise direct the laser pulses along a single path, which can be directed to the 916 beam delivery system, which can include lenses and the like.
[094] As described above and additionally below, in some embodiments, laser pulses can be generated in bursts. FIGURE 10D depicts a simplified timing diagram representative of laser pulse timing used in performing laser machining according to some embodiments. Laser bursts 1040 to 1042 are generated and directed to object 950. Bursts 1040 to 1042 include multiple laser pulses, which in some cases can increase laser drilling and / or laser machining. For example, laser bursts may be formed and / or used in a manner similar to that described in U.S. Patent No. 6,664,498, which is incorporated herein in its entirety by reference. Other methods can be used to generate multiple bursts from bursts 1040 to 1042, such as, but not limited to, collecting pulses on a high repetition rate train and amplifying them, making a second peak regenerative amplifier work on a correct state of desired misalignment, and / or other related methods.
[095] The pulses of a burst 1040 to 1042 are separated by a first duration 1044, and sequential bursts 1040 to 1042 are separated by a second duration 1046. In one example, the first duration 1044 is
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31/78 of approximately 50 to 200 ns, with the second duration 1046 being approximately 0.5 ms. In addition, in some implementations, each laser pulse has a pulse duration within the range of approximately 10 ps to 100 ns. A time between each laser pulse of each burst can be within a range of approximately 5 ns to 5ps. Additionally, a time between successive bursts is greater than the time between each laser pulse comprising each burst, in which an intensity of the first laser pulse and / or the second laser pulse of each burst exceeds an object's damage threshold. that is being machined. The time between bursts 202 is determined by the pulse repetition rate of the laser which can vary from a few Hertz to approximately 100 kilohertz; however, the time between bursts 202 is substantially greater than the time between pulses 204, 206 within each burst 202 (for example, greater than 10 times, or greater than 100 times, or greater than 1000 times the time). duration between pulses 204, 206). Again, however, the back wall protection provided by the present embodiments can be used with substantially any laser pulses, pulse durations, durations between pulses and / or durations between bursts of pulses while considering bubble formation, disruption and / or dispersion .
[096] In FIGURE 10C each of the bursts 1040 to 1042 is separated by the single second duration 1046. As described above, however, the first duration 1044 and / or the second duration 1046 may vary over time, as based on programming predefined machining, such as as a result of the detection that the laser pulses have broken the wall of the object 950 being machined, a predicted amount of time or other related factors. In other embodiments, laser machining is performed with single pulses instead of or in cooperation with multipulse bursts.
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32/78 [097] With reference to FIGURES 10C and D, the first timing generator 1012 can partly arrange the pulses of a burst 1040, such as double pulse bursts with each pulse generated from one of the first and second lasers 1014 and 1015. The second timing generator 1018 provides timing to coordinate the first and second pulse slicers 1020 and 1021 to accurately direct the bursts 1040 to 1042 of the two laser pulses according to defined pulse rates to perform relative timing between bursts. 1024 lenses may include lenses relevant to combining laser pulses, such as, but not limited to one or more wave plates, polarizers and the like. In other embodiments, a single 1014 laser is used and the laser beam is split to generate the second pulse with a delay incorporated in the path to obtain the desired duration 1034 between the bursts' pulses.
[098] FIGURE 11 depicts a simplified flow chart of a 1110 laser machining process while providing protection to the rear wall, according to some achievements. In step 1112, a fluid is directed into a cavity of an object 950 being laser machined. Typically, the fluid directed into the cavity has no laser absorbing or dispersing properties at the laser pulse wavelengths. Similarly, the fluid is typically substantially free of laser barrier properties. In step 1114, a plurality of laser pulses are directed at a wall of the object 950 being laser machined. The laser pulses are configured to form an orifice through the wall of the object 950 so that the laser pulse passes through the orifice and enters the cavity at the same time as the fluid is directed into the cavity so that the pulse of laser is incident on the fluid and on a surface together in order to inhibit damage to the rear wall.
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33/78 [099] FIGURE 12 depicts a simplified flowchart of a laser machining process 1210 while protecting a back wall surface of a 950 object being laser machined, according to some achievements. In step 1212, a protective substrate (for example, protective substrate 312) is positioned within a cavity of the object 950 so that the protective substrate is aligned with the expected laser path and a hole or other intended laser machining is performed. on a wall of object 950.
[0100] In step 1214, a fluid is directed into the cavity and towards the protective substrate 312. In many embodiments, the fluid does not include laser absorbing properties, and in addition, it can simply be water (for example, water tap water, cold water, super-chilled water, etc.), alcohol, liquid gas (for example, liquid nitrogen) or other relevant fluids that can transmit laser light and in at least some cases boil so that the laser energy. In some cases, a surfactant may be included with the fluid to help wet the protective substrate better. In addition, the fluid typically does not leave a residue that has to be removed through additional or complex procedures. In addition, the fluid can be directed to directly contact the surface of the protective substrate 312 on which the laser pulses must collide. In step 1216, laser machining is controlled to generate the hole or other laser machining in the object 950 wall. With the protective substrate 312 positioned precisely, the laser pulses that penetrate the object 950 wall and enter the cavity they are incident on the protective substrate 312 and the fluid directed towards the protective substrate so that the protective substrate inhibits the laser pulse from striking the surface of the rear wall through the cavity of the hole being laser machined.
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34/78 [0101] FIGURE 13 depicts a simplified flowchart of a process 1310 of laser machining an object 950 according to some realizations. For example, the 1310 process can be used in laser drilling of a plurality of fuel injector holes near a narrow tip of the fuel injector through which fuel is intended to be ejected when the fuel injector is used inside. an engine. In step 1312, a protective substrate 312 is configured and / or constructed according to a predefined size and shape, which is dependent on the object 950 being laser machined (for example, a fuel injector), the size of the object, the size of the cavity, the space available to access the cavity and other relevant factors. Additionally, in some cases, the dimensions of the protective substrate 312 may depend on the intended laser machining, the desired intensity of the laser pulses, the duration of the laser pulses, the duration between pulses, the duration between laser bursts when they are used bursts, from the support (e.g., fluid conduit 314) to the protective substrate 312 when positioned within the cavity and the coupling of the protective substrate with the fluid conduit 314, and other similar factors. For example, in some embodiments, the protective substrate is formed by machining the fluid conduit 314 to cut the protective substrate 312 directly from the fluid conduit. The protective substrate 312, in some cases, can be folded relative to a geometric axis of the fluid conduit 314 to allow the surface of the protective substrate to be positioned inside the cavity at a desired angle relative to the path of the laser pulses and / or so that the fluid released from the fluid conduit 314 is at least partially directed to the protective substrate 312.
[0102] In step 1314, one or more surface structures, such as openings, and / or irregularities are formed in the protective substrate
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312. For example, in some embodiments, a grid or matrix of openings 512 is machined, laser drilled or otherwise formed in the protective substrate. For example, the grid of openings and / or depressions can be formed in a compressed configuration close to hexagonal with a cross section of the openings and / or depressions being tapered. In step 1316, the protective substrate 312 is supported by the fluid conduit 314, which is cooperated with the positioning support 712. The fluid conduit 314 is additionally cooperated with an outlet from the fluid supply system 936 (for example, coupled to an output of a flow meter 940). In step 1318, gas conduit 340 is mounted with positioning bracket 712, and connected to the outlet of the gas supply system 926 (for example, an outlet from a flow meter 932).
[0103] In step 1320, a 950 object to be laser machined (for example, a fuel injector) is positioned so that a part of the object to be laser machined is close to the laser focus when activated. In some embodiments, the 924 positioning system can position the 950 object in the desired location. It is observed that the object 950 to be laser machined and / or the laser does not have to be positioned so that the laser focus 218 is directly in the center of an orifice or other gap to be laser machined. In fact, in some cases it may be beneficial and desired that the focal point is not positioned in the center of an orifice being formed. For example, the laser focus 218 can be directed to be radially in the center of an orifice to be formed, but not axially. In other cases, focus 218 can be positioned outside object 950. Similarly, in some cases, such as when a boring head is being used, the laser can be moved, for example, to process around a circumference of a hole or gap that is being worked on. In step 1322, the protection system 310 is positioned inside the cavity of the
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36/78 object 950 so that the protective substrate 312 is in alignment with the intended path of the laser pulses.
[0104] In step 1324, laser parameters are determined for the 912 laser system, such as laser power, pulse timing (for example, double pulse timing) and other similar relevant parameters. In step 1326, the one or more pulse slicers 914 are configured to determine a selection rate. In some embodiments, steps 1324 and 1326 are configured according to a machining plan, which may include varying over time one or more of the laser parameters and / or selection rates during laser machining, as based in expected burn timing and / or in response to burn detection. In step 1320, the beam delivery system 916 is configured, such as configuring a boring head when desired.
[0105] In step 1332, the fluid supply system 936 and gas supply system 926 are configured to determine the gas and fluid flow rates and are activated to initiate the supply of fluid and gas into the object cavity 950. In some embodiments, a gas is additionally delivered to an auxiliary gas jet when relevant, so that a gas flow is directed along an exterior of object 950. In step 1334, one or more shutters are configured to the desired timing and laser drilling is activated to drill a first hole in object 950.
[0106] In some embodiments, multiple holes or other laser machining can be performed on the 950 object. For example, when the object is a fuel injector, typically multiple holes are laser drilled into the fuel injector. Consequently, some achievements include step 1336, where object 950 is rotated or otherwise moved to a new target point on object 950. In step 1340, the object
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950 is positioned relevant to the laser focus. In some implementations, the rotation and positioning of the 950 object is implemented by the 924 positioning system. In step 1342, one or more shutters are configured for the desired drilling time and laser drilling is implemented. When laser drilling and / or additional machining must be performed, process 1310 may return to step 1336 to rotate or otherwise reposition object 950 for subsequent laser drilling or machining.
[0107] When laser drilling is complete, the process continues to step 1344 where the protection system 310 is removed from the cavity. In step 1346, a subsequent object 950 is positioned relative to the laser system 912. In step 1348 the protective system 310 is inserted into the cavity. In step 1350, the subsequent object 950 is positioned relative to the laser focus. The 1310 process can then return to step 1334 to set the shutter timing and implement laser drilling.
[0108] Some designs provide protection of the back wall without inserting the protective substrate between the laser pulse and the back wall. In part, this protection scheme is implemented by supplying a fluid into the cavity of the object being laser machined while controlling the laser pulses and synchronizing the laser pulses during laser machining.
[0109] FIGURE 14 depicts a simplified flow chart of a 1410 process, according to some embodiments, to protect a back wall of a 950 object (for example, a turbine blade, fuel injector or substantially any object) during machining laser of that object. In step 1412, a fluid delivery system is activated to deliver a fluid into a cavity of the 950 object. Typically, the fluid delivered into the cavity has no properties
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38/78 of laser absorption or dispersion, and in many cases simply water is supplied into the cavity of the 950 object. The fluid that is in contact with the rear wall being protected from damage, and in some cases substantially fills or fills the object's cavity. In step 1414, a plurality of pulses and / or laser bursts are generated. Typically, laser pulses are delivered in bursts, with each burst including multiple laser pulses (for example, two pulses) that are separated in time only by a short duration, at least relative to the duration of bursts. The generation of laser bursts and the use of laser bursts in laser machining are described in U.S. Patent No. 6,664,498 to Forsman and others, which is incorporated in full in this document by reference.
[0110] In step 1416, the timing between laser pulses and / or bursts that collide on the 950 object is controlled precisely so that the laser pulses are generally not incident on the rear wall while single or multiple bubbles are present on the wall rear.
[0111] Consequently, laser pulses are incident on the fluid and the back wall surface, with the fluid and the back wall surface together inhibiting damage to the back wall. In some cases, the synchronism between pulses and / or laser bursts is controlled by selecting a subset of the laser bursts and directing the subset of the laser bursts on the object 950 according to pre-defined synchronism to thereby limit and / or prevent damage to the rear wall with the auxiliary fluid remaining in contact with the rear wall. The predefined timing is dependent on the generation and / or cavitation of bubbles within the fluid as a result of the laser pulses.
[0112] FIGURE 15 depicts a simplified diagram section view of a 1510 object during laser machining according to
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39/78 some achievements. The laser pulses 1512 are directed at the object 1510 through lenses 1514 and the like to implement laser machining, such as laser drilling of one or more holes 1518 in a wall 1520 of the object 1510. Following the rupture of the wall 1520, pulses subsequent laser beams continue to be directed at the object to obtain a desired quality and / or width of hole 1518. As such, at least a portion of the laser pulses directed at object 1510 following the break pass through the hole to enter cavity 1522 of the object and can continue through the cavity to collide on a surface 1524 of a rear wall 1526 (where the rear wall 1526 of some objects 1510 is a continuation or the same wall 1520 being laser machined on the opposite side of cavity 1522) and can potentially cause damage to the rear wall. Laser pulses that directly collide on the surface of the rear wall 1524 can produce a plasma of the material of the rear wall 1526 that can cause damage to the rear wall and / or reduce the integrity of the rear wall at that point, produce a flow of hot gases and in some cases produce some debris as parts of the rear wall that can be ejected resulting in damage to the rear wall.
[0113] Consequently, some designs direct a fluid 1530 into cavity 1522 at the same time as they perform laser machining. The fluid typically does not include laser-absorbing properties, and in some cases it is water, alcohol or other relevant fluids. A surfactant can be included with the fluid in some implementations to help wet the back wall surface. The amount of fluid 1530 maintained on the back wall surface 1524 may depend on the intensity and / or power of the laser pulse 1512, the distance from the back wall surface 1524 to the laser spot 1532, the back wall material, the duration of the laser pulses, duration between pulses and / or other factors
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40/78 similar. The flow of fluid into the cavity may depend on the volume of the cavity, the pulse rate, the expected formation, disruption and / or dispersion of the bubble, and / or other similar factors. In addition, the flow rate can be controlled to prevent fluid from entering the orifice being laser drilled. Again, internal and / or external gas jets can also be used to keep the fluid away from the orifice.
[0114] Additionally, the duration between laser pulses and / or laser pulse bursts is additionally controlled to reduce the potential damage to the rear wall that would otherwise occur. It has been identified that while the fluid, such as water, is in contact with the surface of the rear wall 1524, the reflectivity on the surface of the rear wall 1524 is increased. With increased reflectivity, the fluid and back wall surface together inhibit damage to the back wall with laser pulses that collide on the back wall surface 1524 being readily reflected from the back wall surface and consequently resulting in minimal ablation if plasma formation and / or other damage to the back wall surface while reflectivity is maintained. The reflected laser pulses continue to spread, reducing the intensity and the likelihood of causing additional damage to the internal surface of cavity 1522.
[0115] However, it has been further identified that the laser pulses 1512 can cause the formation of cavitation or bubbles within the fluid 1530. The formation of bubbles on or near the surface of the rear wall 1524 can reduce the reflectivity of the surface of the rear wall, for example, due to the lack of fluid 1530 on the back wall surface when a bubble forms on the back wall surface. With reduced reflectivity, subsequent laser pulses can cause damage and / or ablation
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41/78 increased on the surface of the rear wall 1524, for example, due to the laser pulse striking a part of the surface of the dry or substantially dry rear wall 1524 where a bubble has formed.
[0116] Consequently, some achievements reduce and / or eliminate potential damage to the rear wall by controlling the timing of the laser pulses directed at the 1510 object while the fluid is delivered into the cavity so that bubbles formed as a result of one or more pulses of Previous lasers wilt substantially or totally before a subsequent pulse is directed at the object. As a result, fluid 1530 is in contact with the surface of the rear wall 1524 and provides increased reflectivity, which reduces the formation of plasma and / or ablation of the surface of the rear wall.
[0117] Additionally, some achievements direct a flow of gas 1536 (eg, air, nitrogen, argon, helium or other relevant gases) into cavity 1522, typically through the area to be laser machined. Consequently, gas flow 1536 can limit or prevent fluid 1530 from entering orifice 1518 when formed and / or contacting the orifice, which can potentially cause burning on the surface of orifice 1518 in some cases. Additionally, some embodiments direct one or more gas flows 1540 into orifice 1518 and / or through an outer object surface 1510, which in part can remove debris during laser machining and / or inhibit fluid from inside the cavity enter the hole.
[0118] FIGURE 16A depicts a simplified timing diagram representative of laser pulse timing used in performing laser machining according to some embodiments. A series of laser pulses 1612 and 1613 are directed at an object being laser machined. It was discovered that at least with some intensities and
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42/78 laser distances to a laser focus, bubbles may be formed on the rear wall 1524 of cavity 1522 of the object as a result of laser pulse 1612. Bubbles that may form near or adjacent to the rear wall 1524 may result in one or more subsequent laser pulses hitting a part of the dry or substantially dry back wall due to bubbles, which can reduce reflectivity on the back wall and / or reduce a cooling effect provided by the liquid.
[0119] Consequently, the laser system can be controlled so that a second laser pulse 1613 is not directed at object 1510 until the expiration of the second duration 1622 following the first burst 1612. Consequently, the laser system is controlled so that a second second pulse 1613 is not directed at object 1510 for an expected duration or amount of time 1624 that is predicted for substantially all or all bubbles close to the surface of the rear wall 1524 to wither or disperse. Again, duration 1624 is defined partly based on the intensity or power of the laser, the distance between the laser focus 1532 and the surface of the rear wall 1524, in the fluid 1530, in the expected time for the formation and disruption of substantially all the bubbles formed on the surface of the rear wall 1524 by the first laser pulse 1612, and other similar factors. As an example, the duration 1624 between the subsequent pulses 1612 and 1613 can be approximately 0.5 ms. The bubbles produced in the fluid that result from the initial laser burst typically fade relatively quickly on the back wall, particularly when the laser intensity on the back wall is relatively low.
[0120] FIGURE 16B depicts a simplified timing diagram representative of laser pulse timing used in performing laser machining according to some achievements. As
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43/78 described above, and as described in U.S. Patent No. 6,664,498, the use of bursts 1632 to 1635 of laser pulses may increase laser drilling and / or laser machining. It has been found that at least with some laser intensities a first burst 1632 of two laser pulses separated by a first duration 1640 may not produce bubbles on the surface of the back wall 1524. Additionally, the second duration 1642 between the laser bursts 1632 and 1633 is selected so that bubbles are not formed before the second burst 1633. In some cases, bubbles can be formed at or near the laser spot 1532 when fluid 1530 is present at or near the spot; however, bubbles are typically not formed near the rear wall as a result of the first burst 1632, or are not formed at least before the second burst 1633 collides on the surface of the rear wall 1524.
[0121] Consequently, a second burst 1633 can be directed at object 1510 in the second duration 1642 that follows the first burst 1632. Those parts of the pulses of the second burst 1633 that pass through the hole 1518 will collide on the surface of the back wall 1524 while the fluid 1530 is in contact with the surface of the rear wall and before bubble formation.
[0122] Bubbles are likely to form in response to the second burst 1633 of the first set of bursts. Consequently, a subsequent third burst 1634 of a second set of bursts is directed at object 1510 following a third duration 1644, which is typically relatively large compared to the first duration 1640 that separates the pulses within a burst (for example, times hundreds of times). times greater, or thousands of times greater than the duration time 1640 between the pulses), and greater than the second duration 1642 between the first and second bursts 1632-1633 (for example, five, tens or hundreds of times greater
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44/78 than the duration time 1642 between bursts of a first set of bursts). The third duration 1644 is defined based on the intensity or power of the laser, the distance between the laser focus 1532 and the surface of the back wall 1524, in the fluid 1530, in the viscosity, density, and surface tension of the fluid, in the angle of incidence in the rear wall, in the flow rate, in the time predicted for the formation and disruption and / or dispersion of substantially all the bubbles formed on the surface of the rear wall 1524 by the first and / or second bursts 1632 and 1633, and in other similar factors. As an example, the first duration 1640 between pulses of a burst 1632 can be between approximately 50 and 200 ms, and the second duration 1642 between the first and second bursts 1632 and 1633 may be approximately 0.1 ms. The sets of bursts separated by the third duration 1644 can be approximately 0.5 ms. Consequently, bubbles produced in the fluid resulting from the two successive laser bursts typically wither relatively quickly on the rear wall, particularly when the laser intensity on the rear wall is relatively low. Some achievements take into account an estimated time for several sized bubbles to wilt when controlled by surface tension for various estimated bubble sizes. The suitability of the timing was verified through tests creating and preventing damage to the rear wall in a tube. Again, the fluid flow can help to blister the bubbles and / or move the bubbles away from the back wall where the laser is supposed to collide.
[0123] With some realizations, according to some tests, the laser intensity was on the order of between approximately 10X and 100X more intense in the laser focus than in the location of the rear wall which is approximately 2 to 3 mm away from the focus of laser (for example, the intensity of the laser on the back wall can, at least in some
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45/78 implementations, stay in the range between 10 ⁷ W / cm ² and 10 ⁹ W / cm ² ). Consequently, the bubble formation on the surface of the rear wall is less than that which would occur in the laser focus. Additionally, a single pulse may not form bubbles on the surface of the back wall allowing multiple pulses of a burst to be used to improve work while still limiting or preventing damage to the back wall. It is observed that the fluid directed into the cavity can help to disperse and remove some of the bubbles. A high rate of fluid flow can help sweep at least some of the bubbles away. Similarly, in some cases, the fluid flow can disperse or sweep substantially, if not all, bubbles away from the back wall where the laser collides, which can allow for a substantially continuous operation of the laser system, such as continuous laser bursts with much shorter durations between bursts. For example, depending on the size of the cavity, the flow can be in the order of 5 m / s. Again, however, this flow rate can be difficult to maintain at tight geometries, such as some fuel injector geometries.
[0124] The protection of the rear wall provided by the present embodiments, however, is not limited to these laser and / or synchronism pulses. Alternatively, the back wall protection can be used with substantially any laser pulses, laser pulse durations and / or durations between pulses or bursts of pulses while taking into account bubble formation and time for bubbles to dissolve, dissipate and / or move away from the area where the laser should collide. In addition, switching and / or pulse control can be used in a similar way in cooperation with the protective substrate of the rear wall (eg substrate 312). Consequently, pulse and / or burst control can be used at the same time as the
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46/78 protection of the rear wall is positioned inside the cavity of the object being laser machined.
[0125] In some cases, the fluid 1530 may partially enter the orifice 1518 that is being laser machined and consequently be close to the laser spot 1532. The bubble formation that can occur near the laser spot 1532 may in some cases increase laser machining. For example, the formation of bubbles close to the laser focus as a result of the first burst 1632 may allow the second burst 1633 to collide on a relatively dry surface due to bubble formation providing improved plasma formation and ablation close to the laser focus, the which can improve laser machining by obtaining the desired laser machining (for example, forming a 1518 orifice), and can additionally prevent fluid from entering the orifice.
[0126] FIGURE 17 shows a simplified timing diagram representative of laser pulse timing used in performing laser machining according to some achievements. A laser system can generate a series of bursts 1712 to 1723. A subset of these bursts can be selected and directed to the object to perform laser machining according to the predefined timing. In some cases, a pulse slicer can be controlled based on the pre-defined timing to select those pulses to be addressed to the object. For example, the first and second bursts 1712 and 1713 can be selected, with the first and second bursts being separated by a first duration (for example, first duration 1732). As described above, in some cases, with the first and second bursts being synchronized, bubbles will not form on the surface of the rear wall until after the second burst 1713. A series of subsequent bursts 1714 to 1721 can be skipped and not directed at the object 1510. Based on an expected time for
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47/78 the bubbles wither on the surface of the rear wall 1524, the second duration 1734 is determined and the slicer can select a second subset of bursts to be directed to object 1510, for example, the eleventh and twelfth bursts 1722 and 1723 , which correspond to the desired duration between sets of bursts. As such, a second subset of bursts is selected according to the predefined timing so that the eleventh and twelfth bursts 1722-1723 collide on the surface of the back wall 1524 after substantially all or all bubbles formed as a result of the first subset of bursts wilt and fluid 1530 comes into contact with the surface of the back wall 1524. In some cases, a pair of bursts can be selected from each of a predefined number of bursts (for example, two bursts are selected from each set of frequent bursts).
[0127] FIGURE 18 depicts a simplified block diagram of an 1810 laser machining system, according to some realizations. The 1810 laser machining system includes an 1812 laser system, an 1814 protection system that cooperates with the 1816 object to be laser machined, a motion control and / or 1818 positioning system (referred to below as the positioning system ), and an 1820 controller.
[0128] Controller 820 can be configured as a single device or separate devices, such as including controllers in the 1812 laser system, the 1814 protection system and / or the 1818 positioning system. In some embodiments, the 1820 controller comprises a or more processors and / or microprocessors coupled to the memory that stores code, instructions and / or software to control the 1810 laser machining system. In some implementations, the 1820 controller can be at least partially implemented via a
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48/78 computer coupled to one or more of the 1812 laser system, the 1814 protection system and the 1818 positioning system.
[0129] The 1812 laser system generates the laser pulses and directs the laser pulses to accurately impact the 1816 object being laser machined at the desired location on the object. Typically, the 1812 laser system includes lenses, slicers and the like to focus and direct the laser pulses to collide on the 1816 object. In some embodiments, the 1812 laser system includes additional elements and / or features, such as delay paths and the like to produce one or more laser pulses to collide on the 1816 object to obtain the desired laser machining.
[0130] The 1814 protection system cooperates with the 1820 controller and the 1816 object to provide back wall protection for the part of the object opposite the orifice or other machining being generated. In some embodiments, the 1814 protection system provides fluid into the cavity so that the fluid provides protection for the rear wall of an 1816 object cavity opposite the part of the object being laser machined. The 1814 protection system additionally includes a slicer controller (for example, pulse slicer 914 and timer and / or signal processor 946) that cooperates with the 1810 laser system and / or is part of the 1810 laser system to control selecting a subset of pulses and / or pulse bursts from a series of pulses and / or bursts. Consequently, the slicer 914, the controller 1820 and the signal processor 946 may, in some implementations, direct a subset of a series of pulses or bursts of pulses on the object 1816 while preventing some of the pulses or bursts of pulses are directed at the object to control bubble formation and / or bubble breakdown on the back wall surface 1524 to protect the back wall surface. In some implementations, the 1814 protection system may include
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49/78 additional or alternative components, such as, but not limited to, a 926 gas supply system that can supply one or more internal or external gas streams (for example, a coaxial external auxiliary gas jet, one or more jets along an exterior, and / or other of these auxiliary jets) relating to object 1816, a fluid supply system 936 for supplying fluid into the cavity, one or more flow meters 932, 940, pressure regulators 930 , 944 burn detector and / or other similar components. The 1818 positioning system can cooperate with the 1812 laser system, the 1814 protection system and / or the 1816 object to position the 1810 laser machining system components to precisely laser the 1816 object at the same time. provides rear wall protection. The positioning system can include one or more motors, gears, pumps, pistons, hydraulics, cables, terminal manipulators, grips, and / or other similar devices for positioning the components relative to each other. For example, in some implementations, the 1818 positioning system is cooperated with the 1816 object to control the positioning and / or maintain the positioning of the object during laser machining and / or to reposition the object for additional laser machining (eg example, laser drilling of multiple holes in object 1816). Additionally or alternatively, the 1818 positioning system can cooperate with the 1814 protection system to position at least a part of the protection system to accurately apply fluid into the cavity. Similarly, in some embodiments, the positioning system may provide in part some controls over the positioning of the 1812 laser system or parts of the laser system to precisely focus and direct the laser pulse towards the 1816 object.
[0131] FIGURE 19 depicts a simplified flow chart of a
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50/78 1910 process to provide protection of the rear wall during laser machining, according to some achievements. In step 1912, a laser source is configured relative to an object to be laser machined (for example, object 1510). This may include configuring a laser power and other similar parameters. In addition, this may include the positioning of the laser source, the object to be laser machined and / or the protection system and / or substrate. In some embodiments, the protection system is fixed and the object to be laser machined is moved into position so that the protective substrate is in a desired position. In other embodiments, the object is positioned in a fixed position and the protection system is moved to a position relative to the surface of the object to be protected. In addition, positioning can be based on registers, sensors and / or contact of one or more parts of the protection system with one or more parts of the object to be laser machined.
[0132] In step 1914, a fluid is supplied into a cavity of object 1510 that is being laser machined to at least maintain a layer of fluid on a surface of the back wall 1524. In step 1916, the laser source is activated. In step 1920, a selection of a subset of laser pulses is directed at object 1510, where a timing between laser pulses directed at the object is controlled according to the intensity of the laser, the distance from a focus to the surface of the rear wall 1524, the fluid being delivered into the cavity, the rate of bubble breakdown predicted in the fluid provided, and other similar factors. As described above, in some cases, laser bursts comprising multiple laser pulses can be used, and in some cases sets of bursts are directed at object 1510 with the duration between sets of bursts being pre-defined according to an expected time so that the bubbles formed on the surface of the rear wall 1524 wither.
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51/78 [0133] FIGURE 20 depicts a simplified flowchart of a 2010 process of laser machining an 1816 object according to some achievements. For example, the 2010 process can be used to laser drill a plurality of holes in parts of an airplane or engine (turbine blade), fuel injector or other object where laser machining is to be performed on at least one side of cavity, which can expose the opposite side of the cavity to potential damage. In step 2012, a fluid delivery device (for example, nozzle or jet) is cooperated with a support (for example, a 712 positioning support) and connected to an outlet of a 936 fluid supply system (for example, to a 940 flow meter output). In some embodiments, the process includes step 2014, where a gas delivery device (eg, nozzle or jet) is mounted with the support (eg, positioning support 712), and connected to the outlet of the gas supply system. gas 926 (for example, a 932 flow meter outlet).
[0134] In step 2016, an 1816 object to be laser machined (for example, a fuel injector) is positioned so that a part of the object to be laser machined is in the focus of the laser when activated. In some embodiments, the 1818 positioning system can position the 1816 object in the desired location. In step 2020, the fluid delivery device is positioned relative to the cavity of object 1816 to maintain a desired water level within the cavity. It may be desirable, in some cases, for the cavity to be substantially filled with fluid. In some embodiments, the gas delivery device is positioned similarly relative to the interior of the cavity to direct a gas flow through a part of the surface where laser machining is to be performed (for example, where a gas is to be drilled) hole). In other embodiments, the fluid and / or gas delivery devices are positioned and the object is then
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52/78 positioned subsequently relative to the fluid and / or gas delivery devices.
[0135] In step 2022, the laser parameters are determined for the 1810 laser system, such as laser power, pulse timing (for example, double pulse timing) and other similar relevant parameters. In step 2024, the one or more pulse slicers 914 are configured to determine a selection rate, which may include selecting a subset of laser bursts to be directed at the object 1816 while driving a remnant of the laser bursts away from the object . In some embodiments, steps 2022 and 2024 are configured according to a predefined machining plan, which may include varying over time one or more of the laser parameters and / or selection rates during laser machining, such as as based on expected burn time and / or in response to burn detection. In step 2026, the beam delivery system 916 is configured, such as adjusting a boring head when desired.
[0136] In step 2030, the fluid supply system 936 and the gas supply system 926 are configured to determine fluid and gas flow rates and activated to initiate fluid and gas delivery into the object cavity 1816. In some embodiments, a gas is additionally delivered to an auxiliary gas jet when relevant. In step 2032, one or more shutters are configured for the desired timing and laser drilling is activated to drill a first hole in object 1816.
[0137] In some embodiments, multiple holes or other laser machining can be performed on the 1816 object. For example, when the object is a fuel injector, typically multiple holes are laser drilled into the fuel injector. Consequently, some
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53/78 realizations include step 2034, where object 1816 is rotated or otherwise moved to a new target point on object 1816. In step 2036, object 1816 is positioned in the focus of the laser. In some implementations, the rotation and positioning of the 1816 object is implemented by the 1818 positioning system. In step 1840, one or more obturators are configured for the desired drilling time and laser drilling is implemented. When additional drilling and / or laser machining must be performed, the 2010 process can return to step 2034 to rotate or otherwise reposition the 1816 object for laser drilling or subsequent machining.
[0138] When laser drilling is complete the process continues to step 2042 where the fluid delivery device and / or gas delivery device can be removed from the cavity when they are positioned inside the cavity. In step 2044, a subsequent object 1816 is positioned relative to the laser system 1810. In step 2048, the fluid delivery device is positioned relative to the cavity, and when a relevant gas delivery device can be positioned relative to the cavity. In step 2048, the subsequent object 1816 is positioned relative to the laser focus. The 2010 process can then return to step 2032 to set the shutter timing and implement laser drilling of the subsequent object.
[0139] Consequently, the present embodiments provide protection for a surface opposite to a part of an object being laser machined. This protection allows highly accurate laser machining of an object while protecting the object from peripheral damage that can degrade the object or actually render the object unusable. Additionally, when used in manufacturing applications, the rear wall protection provided by the present achievements can greatly improve the
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54/78 capacity while significantly reducing, if not eliminating, the amount of objects that have to be discarded due to peripheral damage that exceeds limit levels. Additionally, protection is achieved without having to introduce a substance that would require significant cleaning and without producing a hazardous waste product.
[0140] FIGURE 21 shows an exemplary sectional view of an object 2110 that has been laser drilled without protection of the rear wall. The laser perforation produced two holes 2112 and 2113 or channels that extend through the wall of the object 2110. As can be seen, during laser drilling the laser pulses collide on the surface of the rear wall 2116 of the cavity 2118 which is opposite to the holes 2112 and 2113 formed by the laser pulses and can produce significant damage to the surface of the rear wall 2116. In some cases, the damage includes damage to the object's wall and structure (eg, heat-affected areas (HAZ)), and in in some cases the damage may extend through the wall to an exterior of the wall 2120 and / or one or more holes may form through the wall.
[0141] Depending on the extent of the damage, the 2110 object being laser machined may become unusable for its intended purpose or have a very short life expectancy.
[0142] For example, laser machining of jet engine parts and / or fuel injectors can have zero or very limited tolerance for damage.
[0143] FIGURE 22, however, shows an exemplary sectional view of a 2210 object that was laser drilled while applying rear wall protection according to some achievements. Providing back wall protection, one or more 2212 and 2213 holes, channels or other laser machining can be generated precisely on the 2210 object without damaging the back wall surface
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2216 of cavity 2218 which is opposite holes 2212 and 2213. Consequently, the use of back wall protection can greatly improve the quality of objects being produced, increase the capacity of the number of objects that can be used for their intended purposes, increase the service life of laser-machined objects and other similar benefits.
[0144] In addition, the rear wall protection provided by some designs can allow laser machining to be very accurate. For example, in some embodiments, laser holes 2212 and 2213 can be formed with a diameter 2230 that is approximately 50 microns extending through an object that has a steel wall with a 2232 thickness of approximately 1.4 mm or more (for example, a 1.0 mm wall thickness with the hole formed at a 45 degree angle), without any HAZ effect. In addition, laser machining can produce holes in close proximity while still limiting or preventing damage to the rear wall. For example, two holes 2212 and 2213 can be formed within 150 pm or less from each other. In addition, the back wall protection prevents debris from the inner surface of the back wall, prevents hot splashes and limits or prevents exposure to hot plasma on the back wall surface. Some achievements additionally provide protection of the rear wall regardless of the material being laser machined without having to drag protective material into the cavity and / or on the surface of the rear wall, which may require extensive and / or expensive cleaning to remove the protective material.
[0145] Those realizations that use the protective substrate 312 and / or protection system 310 that is inserted in a cavity and / or between the anticipated laser and the surface of the rear wall can typically be used to withstand intensities and / or powers of higher than
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56/78 the realizations that do not use the protective substrate 312. Additionally, the timing of the pulse when performing laser machining at the same time that a protective substrate 312 is positioned inside the cavity can be configured so that the synchronism between pulses and / or bursts can be reduced relative to timing when using back wall protection without protective substrate 312 and instead of controlling burst timing to allow bubbles formed by previous pulses or bursts to wither.
[0146] FIGURE 23 depicts a cut view of a simplified diagram of a 2310 laser machining protection system according to some realizations. The protection system 2310 includes a sacrifice insert or protective substrate 2312, a fluid source 2314 that supplies a fluid 2316, and one or more sources of gas 2318, 2320. The protective substrate 2312 is positioned close to or in contact with a surface of the rear wall of the 2324 object being laser machined. The fluid source 2314 is positioned relative to the cavity 2326 of the object so that a layer of fluid 2316 is maintained within the cavity. The fluid source 2314, such as a conduit, nozzle or the like is part of a fluid delivery system 936 that controls the flow of fluid into the cavity. Similarly, in some embodiments, the 2318 gas source may be a conduit, nozzle or the like that is part of a 926 gas delivery system that delivers a gas (eg, air) into the cavity and along the cavity surface to limit or prevent fluid 2316 from entering orifice 2330. Some embodiments may include a second gas source 2320 that is part of a gas supply system 926 or a separate gas supply system that directs a gas ( for example, air) coaxially to the 2332 laser (it is noted that one or more additional or alternative gas sources can be included, such as a nozzle to deliver a gas through the outer surface of the 2324 object).
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57/78 [0147] Fluid 2316 typically has no laser absorption or dispersion properties and provides cooling of the protective substrate 2312. Laser pulses 2332 pass through orifice 2330 when the orifice continues to be formed to collide over the protective substrate 2312. As such, protective substrate 2312 and fluid 2316 provide protection of the back wall of object 2324 during laser machining. In some cases, fluid 2316 is directed to flow through the protective substrate 2312, which can move bubbles that can form within the fluid away from the area being hit by the laser so that the fluid remains in contact with the protective substrate surface and increase the reflectivity on the surface. The protective substrate 2312 can be formed from substantially any relevant materials that can withstand repeated exposure to laser pulses used in laser machining of object 2324, such as, but not limited to Inconel (R), copper, nickel, steel , carbon, ceramic, or other similar materials or combinations of these materials. In some cases, the protective substrate 2312 can be formed from a highly reflective material and / or coated with a reflective material. Structures and / or surface irregularities can be included in the protective substrate 2312, such as those described above. In some embodiments, the protective substrate 2312 can be formed from a porous material.
[0148] FIGURE 24 depicts a simplified section view of an alternative laser machining protection system 2410 according to some realizations. The protection system 2410 includes a hollow protective substrate 2412 and a fluid source 2414.
[0149] The protective substrate 2412 is positioned with a cavity 2426 relative to a rear wall 2428 of the object 2432 being laser machined. The fluid source 2414 provides a fluid 2416 for
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58/78 within the hollow part 2418 of the protective substrate. The protective substrate 2412 is formed from a porous material, such as porous copper, carbon or the like. Typically, the pore sizes on the protective substrate are small enough that the fluid does not readily flow out of the protective substrate. When the laser pulses 2420 collide on the protective substrate 2412 the protective substrate is heated causing the fluid adjacent to the outer surface, inside the pores and / or inside the protective substrate to boil generating steam 2422 which is at least partially released through the pores of the protective substrate and can be evacuated from cavity 2430 of object 2432, such as through a flow of gas, vacuum or the like. In some implementations, the pores are configured so that the fluid is forced through the pores (or holes depending on the configuration of the protective substrate) at a desired rate to keep the fluid on the surface of the protective substrate 2412 on which the laser collides . When the laser collides with the fluid, it can be boiled and replaced with additional fluid that is released through the pores and / or holes.
[0150] The protective substrate 2412, in some cases, is positioned close to the rear wall 2428, and is often positioned so close to the rear wall, which increases the distance between the protective substrate and a laser focus, and takes into account consideration the cavity structure, fluid flow and other relevant factors. In some implementations, the protective substrate 2412 can be configured as rotationally symmetric. The rotationally symmetrical protective substrate can be rotated during work to expose different parts of the surface while working. In some cases, the protective substrate can be rotated continuously.
[0151] The methods, techniques, controls, systems, devices and the like described in this document can be used, implemented and / or
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59/78 work on many different types of devices and / or systems in cooperation with one or more laser sources. With reference to FIGURE 25, a system 2510 is illustrated that can be used for any of these implementations, according to some realizations. One or more components of the 2510 system can be used to implement any device, system or device mentioned above or below, or parts of these systems, devices or devices, such as for example any of the 820, 922, 946, 1820 controllers, positioning systems 818, 924, 1818, mentioned above or below and the like. However, the use of the 2510 system or any part of it is certainly not required.
[0152] As an example, the 2510 system may comprise a 2512 controller or processor module, 2514 memory, a 2516 user interface, and one or more links, paths, communication buses or the like 2520. A power supply or supply (not shown) is included or attached to the 2510 system. The 2512 controller can be implemented through one or more processors, microprocessors, central processing unit, logic, local digital storage, firmware and / or other control hardware and / or software , and can be used to perform or assist in performing the steps of the methods and techniques described in this document, and to control various activations, positions, selections, rates, durations, flow rates, pressures, timing, detections, movement, etc. The 2516 user interface can allow a user to interact with the 2510 system, determine parameters, adjust operating conditions and receive information through the system. In some cases, user interface 2516 includes a display 2522 and / or one or more user inputs 2524, such as a keyboard, mouse, pointing device, buttons, touchscreen, remote control, etc., which can be part of or wired or wirelessly coupled to the 2510 system.
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60/78 [0153] In some embodiments, the 2510 system may additionally include one or more interfaces, ports, 2518 communication transceivers and the like to allow the 2510 system to communicate with other components and / or controllers of a machining system laser, communicate with other devices over a distributed network, a local area network, the Internet, 2520 communication link, other networks or communication channels with other devices and / or other similar communications. In addition, the 2518 transceiver can be configured for wired, wireless, optical, fiber optic cable or similar communication configurations or combinations of these communications.
[0154] The 2510 system comprises an example of a control and / or processor-based system with the 2512 controller. Again, the 2512 controller can be implemented through one or more processors, controllers, central processing units, logic, software and others. In addition, in some implementations the 2512 controller can provide multiprocessor functionality.
[0155] Memory 2514, which can be accessed by the 2512 controller, typically includes one or more processor-readable and / or computer-readable media accessed by at least the 2512 controller, and may include volatile and / or non-volatile media, such as such as RAM, ROM, EEPROM, flash memory and / or other memory technology. Additionally, memory 2514 is shown as internal to the 2510 system; however, memory 2514 can be internal, external, or a combination of internal and external memory. External memory can be substantially any relevant memory such as, but not limited to, one or more of secure digital flash memory (SD) cards, universal serial bus (USB) flash drive, other memory cards, hard disk controller and other similar memory or combinations of these memories. Memory 2514 can
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61/78 store code, software, executables, scripts, parameters, settings, limits, log or historical data, user information and the like.
[0156] FIGURE 26 shows an image of a protection system 2610 that has a protective substrate 2612, which may be similar to the protective substrate 312 of FIGURE 4, according to some embodiments. The protective substrate 2612 is cooperated with a fluid conduit 2614 that is substantially straight close to the protective substrate. In addition, the protective substrate 2612 is positioned at an angle to a central geometric axis of the fluid conduit 2614. In addition, the angle is often selected so that the 2620 laser also collides on the protective substrate at an oblique angle. In this configuration, fluid 2640 (shown by the dashed line) is ejected from the end 2642 of the conduit to directly impact the first surface 2616 of the protective substrate at the angle between the protective substrate and the fluid conduit 2614. Consequently, the fluid changes direction when contacting the protective substrate. Additionally, in some embodiments, fluid 2640 is forced into the openings 512 of the grid (see FIGURE 5) when present in the protective substrate 2612. The conduit 2614 can have substantially any relevant size or diameter 2622 that fits within the cavity of the object being laser machined and allow the precise positioning of the protective substrate 2612 relative to the surface of the object to be protected.
[0157] FIGURE 27 shows an image of a protection system 2710 with a protection substrate 2712 that cooperates with a fluid conduit 2714, according to some realizations. In this embodiment, the fluid conduit 2714 has a reduced diameter 2722 compared to the diameter 2622 of the fluid conduit 2614 of FIGURE 26. This narrowed realization allows the protection system 2710 to be used with and / or
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62/78 inserted in smaller spaces and / or smaller objects to be laser machined. A protective substrate 2712 extends from conduit 2714, and typically extends at an angle relative to a central geometric axis of the conduit near end 2742 of conduit 2714. When in use, protective substrate 2712 is positioned so that the laser 2620 is incident on the protective substrate 2722, which in some embodiments includes a plurality of openings 512 or recesses. In some configurations, the fluid conduit 2714 is additionally different from the fluid conduit 2614 of FIGURE 26 in that the fluid conduit may include a curve 2736 close to, but separated by, a distance from the end 2742 of fluid conduit 2714. A curve 2736 can additionally be incorporated based on the object being laser machined and to allow the 2710 protection system to be positioned relative to a surface of the object to be protected. As a result, curve 2736 redirects the fluid causing at least a major part of the fluid to exit the conduit 2714 substantially parallel to the surface of the protective substrate 2712. Typically, the flow of fluid through conduit 2714 is less than the flow of fluid through of the conduit 2614 of the protection system 2610 of FIGURE 26. In addition, the parallel path of the fluid limits the amount of fluid entering the openings 512, when present.
[0158] FIGURE 28 shows a perspective view of a 2812 protection system for use in protecting the surfaces of an object being laser machined according to some embodiments. FIGURE 29 shows a simplified sectional view along a part of a length of the protection system 2812 of FIGURE 28, according to some embodiments. FIGURE 30 shows a perspective view of the protection system 2812 of FIGURE 28 relative to a pole or mounting device 3010 that is used to position the protective substrate 2822 of the
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63/78 2812 protection system inside an object to be laser machined, according to some realizations. With reference to FIGURES 28 to 30, the protection system 2812 includes a first or fluid delivery duct 2814, a second or fluid removal duct 2816, a fluid redirect element 2820, and a protective substrate 2822. In In some embodiments, the 2812 protection system includes one or more spacers or positioning registers 2830 to 2832.
[0159] The redirect element 2820 is positioned close to one end of the delivery conduit 2814, and in some embodiments it is attached to and / or extends from the end of the delivery conduit. Typically, the redirect member 2820 further extends from the delivery line at an angle relative to a geometric axis of the delivery line to extend at least partially over the end of the delivery line. The protective substrate 2822 is positioned near one end of the removal conduit 2816, and in some embodiments it is attached to and / or extends from the end of the removal conduit. Similar to the redirect element 2820, the protective substrate 2822 typically also extends from the removal conduit at an angle relative to a geometric axis of the removal conduit to extend at least partially over the end of the removal conduit 2816.
[0160] Delivery conduit 2814 and removal conduit 2816 are positioned so that the redirect element 2820 and protective substrate 2822 are positioned juxtaposed to each other. Additionally, in some embodiments, the redirect element 2820 and the protective substrate 2822 are positioned opposite each other so that the redirect element 2820 and the protective substrate 2822 are angled towards each other. Fluid 2824 is introduced into the
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64/78 protection system 2812 and is forced through the delivery conduit 2814 towards the redirection element 2820. At least part and in some embodiments a greater part of the fluid is redirected by the redirection element 2820 towards the protection substrate 2822. In some embodiments, the protective substrate comprises a grid of openings 512 or other features as described in this document. Typically, the 2820 redirect element does not include the opening grid. In some embodiments, at least a percentage of fluid 2824 is generally redirected by redirection element 2820 at an oblique angle relative to the surface of the protective substrate 2822 and with sufficient strength and volume so that some fluid is forced into the openings 512 of the grid at a rate to limit or prevent damage to the protective substrate, similar to the protection described above with other achievements. In addition, part of the fluid delivered through the delivery conduit 2814 is typically passed back through the removal conduit 2816. For example, in some embodiments, approximately 10% of the fluid returns along the removal conduit. More or less fluid can be passed back through the removal conduit depending on the size of the removal conduit, the amount of fluid delivered, the amount of fluid redirected and other similar factors. In some embodiments, the removal duct can be repositioned with a lever, bar or other structure to position the protective substrate.
[0161] The 2812 protection system can be of substantially any size and is typically configured relative to the object being worked on. For example, in some embodiments, the distance 2914 through both delivery and removal lines 2814, 2816 held in position by the logs can be in the range of 1 mm to 2 mm (for example,
1.5 mm).
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65/78 [0162] Similarly, the diameter 2916 of the delivery line and / or the removal line can be approximately 100 to 1000 microns in some embodiments. The delivery and removal duct diameters, however, do not have to be the same and can be substantially of any size depending on many factors, such as but not limited to, the size of the area within which the 2822 protective substrate must be. the amount of fluid desired, the intensity and / or pulse rate of the laser, and / or other similar factors. Consequently, the distance 2914 through the two conduits also varies depending on the implementation, and can be substantially any relevant size that fits within the cavity of the object being laser machined as long as sufficient fluid is delivered 2824 and provides protection for the internal surface of the cavity (for example, a rear wall).
[0163] The protection system 2812 is positioned inside an object to be laser machined with the protective substrate 2822 positioned so that the 2912 laser collides on the protective substrate 2822 after having passed through a machined surface of the object. In many implementations, the 2912 laser can additionally crash into and burn the 2820 redirect element. However, the damage to the 2820 redirect element caused by the laser is typically minimal relative to its function and does not adversely interfere with the ability of the 2820 redirect element. to redirect fluid 2824 towards the protective substrate 2822.
[0164] Records 2830 to 2832 are spaced apart at least part of the length of the protection system 2812. In some embodiments, the records are secured in positions along conduits 2814, 2816, for example, through epoxy 2840 , solder, adhesive, clamp, or other similar materials or structures. Records are
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66/78 configured, in at least some embodiments, with dimensions to allow at least some of the records to be inserted into the object to be laser machined and to assist in positioning and maintaining a positioning of the protective substrate 2822 relative to the surface of the object to be be protected. Additionally, in some embodiments, records 2830 and 2832 additionally maintain the position of the delivery conduit 2814 relative to the removal conduit 2816.
[0165] FIGURE 31 illustrates a simplified partial section view of a part of the 2812 protection system of FIGURE 28 positioned within an example object 3110 that is being laser machined (for example, fuel injector), according to some achievements. FIGURE 32 shows a simplified sectional view of the protection system 2812 of FIGURE 31 on the geometric axis A-A, according to some embodiments. The positioning of the 2822 protective substrate in many embodiments is critical, in part due to the relatively small size of the protective substrate, the small size of the laser that is used to perform the machining, and in many cases the small size of the object being machined by laser and / or the area or cavity within which the protection system and protective substrate can be positioned. Consequently, registers 2830 to 2832 can be configured to provide additional positioning of protective substrate 2822 relative to object 3110 being laser machined. The registers can have substantially any configuration and / or shape depending on the object to be laser machined and the cavity into which the protection must be inserted.
[0166] The protection system 2812 is positioned, in the example of FIGURES 31 and 32, so that the redirection element 2820 and the protective substrate 2822 are adjacent to the object 3110 and in some cases in contact with the internal surface of the object 3110.
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67/78 [0167] Additionally, in some implementations, the protection system 2812 is configured so that the ends of the protection substrate 2822 and / or the redirection element 2820 are intended to contact the object 3110 (for example, in a large end 3112) to assist in registering and / or positioning the protective substrate 2822 within the object cavity.
[0168] Additionally, when inserted in some 3110 objects, the shape and / or configuration of the object where the protective substrate is positioned can cause the redirection element 2820 and / or the protective substrate 2822 to be flexed or forced very close. Consequently, in some embodiments, there may be very little or no space between the internal surface of object 3110 and the external surfaces of redirect element 2820 and / or protective substrate 2822.
[0169] Additionally, registers 2830 to 2832 additionally assist in positioning the protection system 2812 and protection substrate 2822 in a desired location relative to the object 3110 being laser machined. In some embodiments, an additional register can be placed to ensure that the protective substrate 2822 is inserted only a desired depth into the cavity. Other registers, structures or other similar measuring devices can be used in positioning the 2812 protection system and the 2822 protection substrate.
[0170] As shown in the example in FIGURES 31 and 32, object 3110 has a cylindrical configuration with a circular cross section and tapers towards a point at a closed end 3112. Laser machining, in this implementation, is intended to occur close to the closed end. In this configuration, records 2830 to 2832 can have
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68/78 a generally circular configuration to correspond to the generally circular cross section. As shown in FIGURE 32, register 2830 has a generally circular outer circumference 3214 and which involves delivery and removal ducts 2814, 2816. Again, in some embodiments, the shape of registers 2830 to 2832 can be determined by the shape of the cavity within from which the 2812 protection system must be inserted. For example, when the cavity size is relatively small, the gap 3124 can be very small (for example, 200 microns or less). In some implementations, there may be no part of the register between a conduit and the internal surface of the 3110 object.
[0171] Additionally, in some embodiments, one or more of the registers 2830 to 2832 may include one or more 3216 cuts, openings or other similar structures, or be formed from a grid or other porous material. The 3216 cuts (or similar structure) allow the 2640 fluid to pass the registers to exit the 3110 object being laser machined. It is noted that FIGURE 32 shows the delivery and removal ducts 2814, 2816 positioned substantially at the center of the circular diameter of the register 2830. In other embodiments, however, the delivery and / or removal ducts may be positioned off-center relative to the register 2830. For example, the delivery and removal ducts can be positioned off-center and close to the outer circumference 3214 of register 2830 or even to the outer circumference. This configuration, in some embodiments, may allow the protective substrate 2822 to be positioned further from the focus of the 2912 laser, which reduces the intensity of the laser on the protective substrate.
[0172] Records 2830 to 2832 can be constructed substantially from any relevant materials that can be molded and / or worked in a desired manner, can cooperate with conduits, and
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69/78 can withstand the resulting fluid and temperatures. For example, in some implementations the registers can be formed from a metal or metal alloy, plastic, ceramic, glass, silicon, or other similar material or combination of materials.
[0173] Again with reference to FIGURE 30, the protection system 2812 is screwed through the channel or hole 3012 of the mounting apparatus 3010 to be directed into the cavity of the object 3110. In some embodiments, the mounting apparatus 3010 additionally includes a clamp 3014 or other similar device to secure the 2812 protection system in a fixed position when inserted into object 3110 at a desired location and / or depth. As described above, delivery conduit 2814 may include a fluid connector 3016 for coupling to a fluid source to supply fluid 2824 within the protection system 2812 and consequently the cavity of the object 3110 being laser machined. A 3020 mounting frame can also be included to position the 3010 mounting apparatus relative to a bracket that secures the 3110 object for laser machining. In some embodiments, once the 2812 protection system is positioned inside the 3110 object and aligned relative to the 2912 laser, the 3110 object can be rotated around the 2812 protection system when the object is to be machined or laser drilled in multiple locations.
[0174] Consequently, the laser system and protection system do not have to be repositioned.
[0175] Additionally, the 2812 protection system can be reused for several laser machining operations (for example, multiple laser perforations on a single object) and typically with several different objects (for example, multiple objects with multiple laser perforations on each object). There are many factors that affect the number of times that a substrate of
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70/78 protection 2822 and / or protection system 2812 can be used, such as, but not limited to, the intensity of the 2912 laser, the distance the protective substrate 2822 is from the focus of the 2912 laser, the pulse patterns of the laser, the accuracy of detecting laser penetration through the object's worked surface and other similar factors. When performing laser machining, which in some cases can be performed consistent with one or more of the processes, methods and / or using the control systems described above, the 2912 laser is directed to one or more desired locations of the object 3110 ( for example, near a closed end 3112 of the object). Once an orifice 3114 is formed in the wall of the object 3110, the laser enters the cavity of the object and can collide on the wall opposite or rear 3116. The protection system 2812 is positioned inside the cavity with the protective substrate 2822 so that the 2912 laser is incident on the protective substrate. As described above, fluid 2824 is redirected by redirection element 2820 to impact the surface of the protective substrate 2822 on which the laser must collide. The fluid can increase the reflectivity of the protective substrate, dissipate heat caused by the 2912 laser, restrict the expansion of plasma formed on the surface of the protective substrate to thereby help reduce the increase in local laser absorption, and provide other advantages.
[0176] Some embodiments may additionally include an external 3120 auxiliary gas jet source, which in some implementations is coaxial to the 2912 laser. The 3120 gas source can direct a flow of gas (eg, air) towards the orifice 3114 that is being laser drilled, which in part removes debris during laser machining and / or inhibits the entry of fluid 2824 into the orifice cavity once drilled. In some embodiments, the protection system 310 additionally includes a gas duct 340, which is configured to also be positioned inside the cavity
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71/78
318. Additionally, the gas flow conduit can be positioned relative to a part of the cavity where the orifice 330 is being drilled. A gas, such as air, oxygen or other relevant gas can be directed into the cavity to limit, and in some cases, prevent the liquid supplied by the delivery conduit 2814 from entering orifice 3114 once formed by laser machining. In some embodiments, the 2820 redirect element provides additional protection against gas flows (for example, from the external auxiliary gas jet source 3120 and / or an internal auxiliary gas jet source when present).
[0177] FIGURE 33A shows a simplified section view of a part of a 3312 laser protection system, according to some embodiments. FIGURE 33B illustrates a simplified partial section view of a part of the laser protection system 3312 of FIGURE 33A positioned within an example object 3110 being laser machined, according to some embodiments. The protection system 3312 includes the protection system 2812 of FIGURES 28 to 32 and additionally includes an internal source of auxiliary gas jet aligned coaxially 3314. In some embodiments, the internal source of auxiliary gas jet 3314 comprises a flue or pipe with protection system 2812 positioned inside the tube. A 3316 gas (for example, air, nitrogen, etc.) is directed around the 2812 protection system to be emitted at one end 3320 of the internal 3314 auxiliary gas jet source near the 2820 redirect element and the protection substrate 2822. The amount of gas delivered and / or the pressure at which the gas is delivered may vary depending on the implementation. Typically, however, pressure is maintained at a level to avoid blowing fluid 2824 out of protective substrate 2822, while helping to prevent fluid from entering orifice 3114 (or the like) that is being laser drilled . In some embodiments, for example, gas can be
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72/78 supplied at a pressure of less than 15 psi. In some embodiments, this protection system 3312 can be used with the mounting apparatus 3010 of FIGURE 30, with the positioning support 712 of FIGURE 7, and / or with another mounting system or similar positioning.
[0178] In some embodiments, the 3312 protection system may include a first set of registers 2830 and 2831 similar to the registers in FIGURES 28 and 31 to position the delivery and removal ducts relative to the tube of the internal source of auxiliary gas jet 3314 Some achievements additionally include a second set of registers 3330 and 3331 which are configured, at least in part, to position the 3312 protection system relative to the 3110 object being laser machined. Again, the second set of registers 3330 and 3331 allows gas 3316 to pass through or around the registers. For example, in some embodiments, the second set of registers 3330 and 3331 may include one or more cuts, holes, or other similar structure to allow the gas to pass.
[0179] Again, during laser machining, laser 2912 generates orifice 3114 through the wall of object 3110 with the protective substrate 2822 positioned so that the laser collides on the protective substrate. As described above, the laser can additionally cause a hole in the 2820 redirect element, but the protective substrate 2822 provides protection for the opposite surface of the object. The redirect element 2820 continues to redirect the fluid while providing some protection against adverse gas dispersion of fluid quantities from the surface of the protective substrate 2822.
[0180] FIGURE 34A shows a simplified sectional view of a part of a 3412 laser protection system, according to some embodiments. FIGURE 34B illustrates a simplified partial section view of part of the laser protection system 3412 of FIGURE 34A positioned
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73/78 inside an exemplary object that is being machined by laser, according to some achievements. The protection system 3412 includes a fluid conduit 3414 that extends to a closed end 3416. A protective substrate 3422 is additionally included, and typically positioned close to the closed end 3416. In some embodiments, the protective substrate 3422 includes a grid of openings 512, is porous and / or otherwise allows fluid 2824 to pass through to the outside of the protective substrate. Additionally, in some embodiments, the protective substrate may be disposed at an oblique angle relative to the 3414 duct and / or may be dependent on the expected angle of the 2912 laser. Fluid 2824 is supplied into the 3414 duct with sufficient pressure to cause the fluid to flow out of the protective substrate 3422 through the opening grid 312.
[0181] In some embodiments, the protective substrate 3422 is formed in a cover 3424 that forms the closed end and in which the grid of holes is formed. The protective substrate can be formed to be substantially at any angle relative to the 3414 conduit, and is typically formed depending on an object expected to be laser machined and the angle the laser enters the cavity. In addition, in some implementations, the thickness of the protective substrate 3422 can be increased relative to the dimensions of the duct due to the thickness of the lid 3424. In some embodiments, a recess or cavity 3426 can be formed in the lid 3424 to form the thickness of the substrate of protection 3422. Similarly, in some embodiments, the angle of the recess 3426 relative to the conduit 3414 may correspond to the angle of the outer surface of the protective substrate. In other embodiments, the angle of the recess 3426 may deviate from the angle of the protective substrate resulting in a change in the thickness of the protective substrate. The cover and / or protective substrate can
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74/78 be formed substantially from any relevant materials, such as those described above. For example, in some embodiments, the cover 3424 and protective substrate 3422 can be formed from Inconel (R).
[0182] The 3412 protection system is positioned inside a 3110 object to be laser machined in a position so that the 2912 laser collides on the 3422 protective substrate and that the 2824 fluid is emitted through the protective substrate. In some embodiments, the protective substrate 3422 is positioned at a maximum distance from the laser focus while still in position to provide protection for the opposite surface of the object 3110. Additionally, in many embodiments, the diameter of the conduit 3414 and, therefore, the cover 3424 may be smaller than some other protection systems. For example, in some embodiments, the diameter of conduit 3414 may be less than 100 microns, and in some embodiments less than 50 microns. This can allow the protective substrate 3422 to be positioned, in at least some configurations, additionally away from the focus of the 2912 laser. Some embodiments additionally include one or more spacers or registers 2830 and 2831. Again, registers 2830 and 2831 can provide accuracy in the positioning of the protective substrate 3422 relative to the wall of the object 3110 to be laser machined. In addition, the registers can be configured with cuts, openings or other structure to allow fluid 2824 to exit object 3110.
[0183] FIGURE 35 shows an image of a 3110 object with 3512 laser damage as a result of laser machining carried out without protection of the rear wall. FIGURE 36 shows an image of an object 3110 without damage to the rear wall after laser machining was carried out at the same time that the protection of the rear wall was used according to some realizations.
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75/78 [0184] Consequently, the protection systems of the present embodiments provide significant protection for objects being laser machined.
[0185] One or more of the achievements, methods, processes, approaches, and / or techniques described above or below can be implemented in one or more computer programs executable by a processor-based system. As an example, this processor-based system may comprise the 2510 processor-based system, a computer, etc. This computer program can be used to perform various steps and / or resources of the methods, processes and / or techniques described above or below. That is, the computer program can be adapted to trigger or configure a processor-based system to perform and perform the functions described above or below. For example, these computer programs can be used to implement any of the steps, processes or techniques described above or below to protect a surface of the back wall of an object during laser machining. As another example, these computer programs can be used to implement any type of machine or similar utility that uses any one or more of the achievements, methods, processes, approaches, and / or techniques described above or below. In some embodiments, program code modules, cycles, subroutines, etc., within the computer program can be used to perform various steps and / or resources of the methods, processes and / or techniques described above or below. In some embodiments, the computer program may be stored or embedded in a computer-readable storage or recording medium or medium, such as any of the computer-readable storage or recording medium or medium described in this document.
[0186] Many of the functional units described in this
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76/78 specification have been labeled as systems, devices or modules, in order to emphasize more particularly their independence of implementation. For example, a system can be implemented as a hardware circuit comprising VLSI circuits or custom port sets, shelf semiconductors such as logic chip chips, transistors, or other discrete components. A system can also be implemented on programmable hardware devices such as field programmable gate sets, programmable logic matrix, programmable logic devices or the like.
[0187] The systems can also be implemented in software for execution by several types of processors. An identified executable code system can, for example, comprise one or more physical or logical blocks of computer instructions that can, for example, be organized as an object, procedure or function. Nevertheless, the executables of an identified system do not need to be physically located together, but may comprise different instructions stored in different locations that, when logically joined, comprise the system and accomplish the defined purpose for the system.
[0188] Consequently, an executable code system can be a single instruction, or many instructions, and can even be distributed over several different code segments, between different programs, and across different memory devices. Similarly, operational data can be identified and illustrated in this document within systems, and can be incorporated in any suitable form and organized into any type of suitable data structure. Operational data can be collected as a single data set, or can be distributed over different locations including different storage devices, and can exist, at least partially,
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77/78 merely as electronic signals in a system or network.
[0189] Some achievements provide methods for laser machining that include:
position a protective substrate within a cavity of an object to be laser machined so that a laser pulse that performs laser machining is incident on a first surface of the protective substrate when the laser pulse passes through an orifice on the object and enters the cavity, and prevent the laser pulse from hitting a surface of the object through the orifice cavity; directing a fluid towards the first surface of the protective substrate when the laser pulse is incident on the first surface; and directing laser pulses on a first surface of the object after positioning the protective substrate within the object's cavity. In some implementations, the fluid is substantially free of laser barrier properties at the wavelength of the laser pulses upon delivery into the cavity by the fluid source.
[0190] Other designs provide systems to protect a back wall or other surface of an object during laser machining. These systems can comprise: a laser system configured to perform laser machining of an object; a control system that cooperates with the laser system; and a fluid source configured to be positioned relative to a cavity of the object to be laser machined and to direct a fluid into the cavity of the object; where the control system is configured to control the laser system so that the laser system generates a series of laser pulses and to control which of the laser pulse series are directed at a part of the object where a orifice so that less than all laser pulses are directed at the object where a timing between pulses that are directed at the object provides protection for an object's rear wall from damage that would otherwise be
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78/78 caused by one or more of the laser pulses directed at the object.
[0191] Although the invention disclosed in this document has been described by means of specific embodiments, examples and applications thereof, various modifications and variations can be made to them by a person skilled in the art without departing from the scope of the invention defined in the claims.
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1/8

权利要求:
Claims (21)
[1]
Claims
1. METHOD TO PROTECT A SURFACE, during laser machining, characterized by comprising directing a fluid (1530, 2316, 2416, 2640, 2824) into a cavity (318, 1522, 2118, 2326, 2426, 2430) object (112, 320, 816, 950, 1510, 1816, 2110, 2210, 2324, 2432, 3110) being laser machined, where the fluid (1530, 2316, 2416, 2640, 2824) has no absorption properties laser; and directing a plurality of laser pulses (212, 324, 1512, 1612, 1613, 2332, 2420) to a wall (114, 326, 1520) of the object (112, 320, 816, 950, 1510, 1816, 2110, 2210, 2324, 2432, 3110) that is being laser machined, where the laser pulses (212, 324, 1512, 1612, 1613, 2332, 2420) are configured to form a hole (214, 330, 1518, 2112, 2113, 2212, 2213, 2330, 3114) through the wall (114, 326, 1520) so that at least one laser pulse (212, 324, 1512, 1612, 1613, 2332, 2420) passes through the hole and between into the cavity (318, 1522, 2118, 2326, 2426, 2430) while the fluid (1530, 2316, 2416, 2640, 2824) is directed into the cavity (318, 1522, 2118, 2326, 2426, 2430) so that the laser pulse (212, 324, 1512, 1612, 1613, 2332, 2420) is incident on the fluid (1530, 2316, 2416, 2640, 2824) and on a surface together in order to inhibit damage to a rear wall ( 120, 332, 1526, 2116, 2216, 2428).
[2]
2. METHOD, according to claim 1, characterized by further comprising:
position a protective substrate (312, 2312, 2412, 2612, 2712, 2822, 3422) that has the surface inside the cavity (318, 1522, 2118, 2326, 2426, 2430) so that the laser pulse (212, 324, 1512, 1612, 1613, 2332, 2420) that passes through the hole (214, 330, 1518, 2112, 2113, 2212, 2213, 2330, 3114) and into the cavity (318, 1522, 2118, 2326, 2426,
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2/8
2430) is incident on the surface of the protective substrate (312, 2312, 2412, 2612, 2712, 2822, 3422); and wherein directing the fluid (1530, 2316, 2416, 2640, 2824) into the cavity (318, 1522, 2118, 2326, 2426, 2430) comprises directing the fluid (1530, 2316, 2416, 2640, 2824) to be in contact with the surface of the protective substrate (312, 2312, 2412, 2612, 2712, 2822, 3422) on which the laser pulse (212, 324, 1512, 1612, 1613, 2332, 2420) falls.
[3]
3. METHOD, according to claim 2, characterized by the fact that the positioning of the protective substrate (312, 2312, 2412, 2612, 2712, 2822, 3422) comprises:
positioning a fluid redirection element (2820) juxtaposed to the protective substrate (2822); directing the fluid (2824) to be in contact with the surface of the protective substrate (312, 2312, 2412, 2612, 2712, 2822, 3422) comprises directing the fluid (2824) to collide with the fluid redirecting element (2820 ), in which at least part of the fluid (2824) is redirected by the redirection element (2820) to collide on the surface of the protective substrate (312, 2312, 2412, 2612, 2712, 2822, 3422) at an oblique angle (416).
[4]
4. METHOD, according to claim 2, characterized by the fact that the targeting of the plurality of laser pulses (212, 324, 1512, 1612, 1613, 2332, 2420) on the object's wall (112, 320, 816, 950, 1510, 1816, 2110, 2210, 2324, 2432, 3110) comprises:
producing a series of laser pulses (212, 324, 1512, 1612, 1613, 2332, 2420); and control which of the laser pulses (212, 324, 1512, 1612, 1613, 2332, 2420) are directed at the object (112, 320, 816, 950, 1510, 1816, 2110, 2210, 2324, 2432, 3110) of so that less than the whole series of pulses of
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3/8 laser is directed at the object (112, 320, 816, 950, 1510, 1816, 2110, 2210, 2324, 2432, 3110).
[5]
5. METHOD, according to claim 2, characterized by further comprising:
rotate the protective substrate (312, 2312, 2412, 2612, 2712, 2822, 3422) relative to the direction of the laser pulse (212, 324, 1512, 1612, 1613, 2332, 2420) so that the laser pulses ( 212, 324, 1512, 1612, 1613, 2332, 2420) are distributed over the protective substrate (312, 2312, 2412, 2612, 2712, 2822, 3422).
[6]
6. METHOD, according to claim 1, characterized by the fact that directing the plurality of laser pulses (212, 324, 1512, 1612, 1613, 2332, 2420) to the object's wall (112, 320, 816, 950, 1510, 1816, 2110, 2210, 2324, 2432, 3110) comprises:
producing a series of laser pulses (212, 324, 1512, 1612, 1613, 2332, 2420); and control which of the laser pulses (212, 324, 1512, 1612, 1613, 2332, 2420) are directed at the object so that less than the entire series of laser pulses (212, 324, 1512, 1612, 1613, 2332, 2420) is addressed to the object (112, 320, 816, 950, 1510, 1816, 2110, 2210, 2324, 2432, 3110).
[7]
7. SYSTEM (310, 710, 814, 920, 1814, 2310, 2410, 2610, 2710, 2812, 3412) FOR USE IN SURFACE PROTECTION during laser machining, characterized by the fact that the system (310, 710, 814, 920, 1814, 2310, 2410, 2610, 2710, 2812, 3412) comprises:
a protective substrate (312, 2312, 2412, 2612, 2712, 2822, 3422) configured to be positioned within a cavity (318, 1522, 2118, 2326, 2426, 2430) of an object (112, 320, 816, 950, 1510, 1816, 2110, 2210, 2324, 2432, 3110) to be laser machined so that a laser pulse (212, 324, 1512, 1612, 1613, 2332, 2420) that performs laser machining
Petition 870180072449, of 08/17/2018, p. 91/97
4/8 is incident on the protective substrate (312, 2312, 2412, 2612, 2712, 2822, 3422) when the laser pulse passes through an orifice (214, 330, 1518, 2112, 2113, 2212, 2213, 2330, 3114) on the object formed by laser machining and enter the cavity (318, 1522, 2118, 2326, 2426, 2430), where the laser pulse is inhibited from striking a back surface of the object (112, 320, 816, 950, 1510, 1816, 2110, 2210, 2324, 2432, 3110) through the cavity (318, 1522, 2118, 2326, 2426, 2430) of the hole (214, 330, 1518, 2112, 2113, 2212, 2213 , 2330, 3114);
a fluid source (938, 2314, 2414) positioned relative to the protective substrate (312, 2312, 2412, 2612, 2712, 2822, 3422), where the fluid source (938, 2314, 2414) is configured to drive a fluid (1530, 2316, 2416, 2640, 2824) towards the protective substrate (312, 2312, 2412, 2612, 2712, 2822, 3422).
[8]
8. SYSTEM (310, 710, 814, 920, 1814, 2310, 2410, 2610, 2710, 2812, 3412), according to claim 7, characterized by the fact that the fluid (1530, 2316, 2416, 2640, 2824) is free of laser barrier properties upon delivery into the cavity (318, 1522, 2118, 2326, 2426, 2430) by the fluid source (938, 2314, 2414) at laser pulse wavelengths (212, 324, 1512, 1612, 1613, 2332, 2420).
[9]
9. SYSTEM (310, 710, 814, 920, 1814, 2310, 2410, 2610, 2710, 2812, 3412), according to claim 8, characterized by the fact that the fluid (1530, 2316, 2416, 2640, 2824) comprises one or more of water, super-chilled water, alcohol, and liquid nitrogen.
[10]
10. SYSTEM (310, 710, 814, 920, 1814, 2310, 2410, 2610, 2710, 2812, 3412), according to claim 7, characterized by the fact that a first surface (414, 612, 2616) of the protective substrate (312, 2312, 2412, 2612, 2712, 2822, 3422) is configured to be positioned in
Petition 870180072449, of 08/17/2018, p. 92/97
5/8 an oblique angle (416) to a direction of the laser pulse (212, 324, 1512,
1612, 1613, 2332, 2420) and on which the laser pulse (212, 324, 1512, 1612,
1613, 2332, 2420) is incident.
[11]
11. SYSTEM (310, 710, 814, 920, 1814, 2310, 2410, 2610, 2710, 2812, 3412), according to claim 10, characterized by the fact that the protective substrate (312, 2312, 2412, 2612, 2712, 2822, 3422) is positioned close to an outlet opening of the fluid source (938, 2314, 2414) so that the fluid (1530, 2316, 2416, 2640, 2824) directly impacts a surface of the substrate of protection in which the laser pulse (212, 324, 1512, 1612, 1613, 2332, 2420) is incident.
[12]
12. SYSTEM (310, 710, 814, 920, 1814, 2310, 2410, 2610, 2710, 2812, 3412), according to claim 10, characterized by the fact that the protective substrate (312, 2312, 2412, 2612, 2712, 2822, 3422) comprises a grid of openings (512).
[13]
13. SYSTEM (310, 710, 814, 920, 1814, 2310, 2410, 2610, 2710, 2812, 3412), according to claim 11, characterized by the fact that the openings (512) of the grid are each tapered (620, 622) along a geometric axis of each of the openings (512).
[14]
14. SYSTEM (310, 710, 814, 920, 1814, 2310, 2410, 2610, 2710, 2812, 3412), according to claim 7, characterized by the fact that the fluid source (938, 2314, 2414) comprises a fluid delivery line (2814) and a redirection element (2820) positioned relative to one end of the fluid delivery line (2814), wherein the redirection element (2820) is positioned juxtaposed to the protective substrate ( 312, 2312, 2412, 2612, 2712, 2822, 3422) and is configured to redirect at least a portion of the fluid (1530, 2316, 2416, 2640, 2824) to contact a protective substrate surface (312, 2312, 2412 , 2612, 2712, 2822, 3422) on which the laser is incident.
Petition 870180072449, of 08/17/2018, p. 93/97
6/8
[15]
15. SYSTEM (310, 710, 814, 920, 1814, 2310, 2410, 2610, 2710, 2812, 3412), according to claim 14, characterized by further comprising:
one or more registers (2830, 2831, 2832, 3330, 3331) positioned over at least the fluid delivery line (2814), where the one or more registers are configured to position the protective substrate (312, 2312, 2412 , 2612, 2712, 2822, 3422) relative to the rear surface of the object (112, 320, 816, 950, 1510, 1816, 2110, 2210, 2324, 2432, 3110) so that the laser collides on the protective substrate ( 312, 2312, 2412, 2612, 2712, 2822, 3422).
[16]
16. SYSTEM (310, 710, 814, 920, 1814, 2310, 2410, 2610, 2710, 2812, 3412), according to claim 14, characterized by further comprising:
an internal auxiliary gas jet source (3314) positioned over and aligned coaxially to at least part of a length of the fluid delivery duct (2814) close to the redirect element (2820), wherein the internal jet source auxiliary gas (3314) is configured to release a gas flow (1536) relative to the orifice (214, 330, 1518, 2112, 2113, 2212, 2213, 2330, 3114) in the object (112, 320, 816, 950, 1510 , 1816, 2110, 2210, 2324, 2432, 3110) that is being formed through laser machining.
[17]
17. SYSTEM (310, 710, 814, 920, 1814, 2310, 2410, 2610, 2710, 2812, 3412), according to claim 7, characterized by the fact that the protective substrate (312, 2312, 2412, 2612, 2712, 2822, 3422) comprises an opening grid (512) in which a first surface of the protective substrate (312, 2312, 2412, 2612, 2712, 2822, 3422) on which the laser pulse (212, 324, 1512, 1612, 1613, 2332, 2420) is incident comprises one or more of openings, protrusions and roughness.
[18]
18. LASER MACHINING METHOD, characterized by the
Petition 870180072449, of 08/17/2018, p. 94/97
7/8 for understanding:
configure a laser source relative to an object (112, 320, 816, 950, 1510, 1816, 2110, 2210, 2324, 2432, 3110) to be laser machined, where the object (112, 320, 816, 950, 1510, 1816, 2110, 2210, 2324, 2432, 3110) to be machined has an internal cavity (318, 1522, 2118, 2326, 2426, 2430) in a part of the object to be laser machined;
controlling the laser source to produce a series of laser pulses (212, 324, 1512, 1612, 1613, 2332, 2420);
supplying a fluid (1530, 2316, 2416, 2640, 2824) into the cavity (318, 1522, 2118, 2326, 2426, 2430) at the same time when performing the laser source control; and control which of the laser pulses (212, 324, 1512, 1612, 1613, 2332, 2420) are directed at a part of the object where an orifice must be produced (214, 330, 1518, 2112, 2113, 2212, 2213, 2330, 3114) so that less than all laser pulses (212, 324, 1512, 1612, 1613, 2332, 2420) are directed at the object (112, 320, 816, 950, 1510, 1816, 2110, 2210 , 2324, 2432, 3110) where a synchronism between the pulses that are directed at the object provides protection of a rear wall (120, 332, 1526, 2116, 2216, 2428) of the object against damage that would otherwise be caused by one or more of the laser pulses (212, 324, 1512, 1612, 1613, 2332, 2420) directed to the object (112, 320, 816, 950, 1510, 1816, 2110, 2210, 2324, 2432, 3110).
[19]
19. METHOD according to claim 18, characterized in that the fluid (1530, 2316, 2416, 2640, 2824) is free of laser barrier properties at a wavelength of the laser pulses (212, 324 , 1512, 1612, 1613, 2332, 2420) upon delivery into the cavity (318, 1522, 2118, 2326, 2426, 2430) by the fluid source (938, 2314, 2414).
[20]
20. METHOD, according to claim 19,
Petition 870180072449, of 08/17/2018, p. 95/97
8/8 characterized by the fact that the control of which of the bursts (1632, 1633, 1712, 1713, 1714, 1715, 1716, 1717, 1718, 1719, 1720, 1721, 1722, 1723) of laser pulses (212, 324, 1512, 1612, 1613, 2332, 2420) are directed at the object part, comprising directing a first burst (1632, 1712) of laser pulses to the object, preventing two or more subsequent bursts (1714, 1715, 1716, 1717, 1718, 1719, 1720, 1721, 1722, 1723) of laser pulses collide on the object (112, 320, 816, 950, 1510, 1816, 2110, 2210, 2324, 2432, 3110) and direct a second burst ( 1633, 1713) of laser pulses that follows the two or more subsequent bursts of laser pulses (212, 324, 1512, 1612, 1613, 2332, 2420).
[21]
21. METHOD, according to claim 20, characterized by the fact that the targeting of the first burst (1632, 1712) of laser pulses and the second burst (1633, 1713) of laser pulses on the object (112, 320, 816, 950, 1510, 1816, 2110, 2210, 2324, 2432, 3110) comprise directing the first burst of laser pulses and the second burst of laser pulses on the object so that a synchronism (1012, 1018) between the first burst (1632, 1712) of laser pulses and the second burst (1633, 1713) of laser pulses to allow bubbles formed by the first burst (1632, 1712) of laser pulses and close to an internal wall surface (120, 332, 1526, 2116, 2216, 2428) of the object opposite the orifice (214, 330, 1518, 2112, 2113, 2212, 2213, 2330, 3114) wither so that an entire area of the rear wall surface over which the laser pulse (212, 324, 1512, 1612, 1613, 2332, 2420) collides is in contact with the fluid (1530, 2316, 2416, 2640, 2824) when the second burst (1633, 1713) of laser pulses is directed at the object (112, 320, 816, 950, 1510, 1816, 2110, 2210, 2324, 2432, 3110).
Petition 870180072449, of 08/17/2018, p. 96/97
1/29
2/29
3/29
4/29

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法律状态:
2018-03-27| B15K| Others concerning applications: alteration of classification|Ipc: B23K 26/12 (2014.01), B23K 26/14 (2014.01) |

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2018-05-22| B06A| Patent application procedure suspended [chapter 6.1 patent gazette]|

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2018-11-06| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|

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2018-12-11| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 07/12/2012, OBSERVADAS AS CONDICOES LEGAIS. |

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2019-02-12| B16C| Correction of notification of the grant [chapter 16.3 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 07/12/2012, OBSERVADAS AS CONDICOES LEGAIS. (CO) REFERENTE A RPI 2501 DE 11/12/2018,QUANTO AO TITULO E O ENDERECO DO DEPOSITANTE. |

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优先权:

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申请号 | 申请日 | 专利标题

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US201161568059P| true| 2011-12-07|2011-12-07|

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US61/568,059|2011-12-07|

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PCT/US2012/068499|WO2013086360A1|2011-12-07|2012-12-07|Methods and systems for use in laser machining|

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